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Part Details for HMC686LP4ETR by Analog Devices Inc
Results Overview of HMC686LP4ETR by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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HMC686LP4ETR Information
HMC686LP4ETR by Analog Devices Inc is a Cellular Telephone Circuit.
Cellular Telephone Circuits are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for HMC686LP4ETR
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 246 |
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RFQ |
Part Details for HMC686LP4ETR
HMC686LP4ETR CAD Models
HMC686LP4ETR Part Data Attributes
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HMC686LP4ETR
Analog Devices Inc
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Datasheet
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HMC686LP4ETR
Analog Devices Inc
BiCMOS Mixer w/Integrated LO Amplifier, 700 - 1500 MHz
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | ROHS COMPLIANT, PLASTIC, QFN-24 | |
| Pin Count | 24 | |
| Manufacturer Package Code | HCP-24-2 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Analog Devices | |
| JESD-30 Code | S-PQCC-N24 | |
| JESD-609 Code | e3 | |
| Length | 4 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4 mm |
HMC686LP4ETR Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a heat sink and thermal interface material. Refer to the application note AN-1369 for more details.
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Use the HMC686LP4ETR evaluation board as a reference and adjust the biasing and matching networks based on your specific frequency and impedance requirements. You can also use simulation tools like ADS or AWR to optimize the design.
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Use a reflow soldering process with a peak temperature of 260°C. Ensure the device is handled and stored in an ESD-safe environment. Refer to the application note AN-1112 for more details on soldering and assembly.
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Use a combination of visual inspection, signal integrity analysis, and debugging tools like oscilloscopes and spectrum analyzers. Check for proper power supply, biasing, and signal routing. Refer to the application note AN-1368 for troubleshooting guidelines.
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The HMC686LP4ETR meets the standards for reliability and environmental testing as per the MIL-STD-883 and JEDEC JESD22-A114 standards. Refer to the datasheet and reliability report for more details.