Part Details for HMC633 by Analog Devices Inc
Results Overview of HMC633 by Analog Devices Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
HMC633 Information
HMC633 by Analog Devices Inc is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for HMC633
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
HMC633-ND
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DigiKey | IC RF AMP VSAT 5GHZ-17GHZ DIE Lead time: 10 Weeks Container: Bulk | Temporarily Out of Stock |
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Buy Now | |
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Analog Devices Inc | Driver amp Chip, 5 - 17 GHz Package Multiple: 25 | 2700 |
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$33.8800 / $51.1000 | Buy Now |
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Rochester Electronics | Driver amp Chip, 5 - 17 GHz RoHS: Compliant Status: Active Min Qty: 1 | 50 |
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$38.2300 / $47.7900 | Buy Now |
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DISTI #
HMC633
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Richardson RFPD | RF & MW DRIVER AMPLIFIER RoHS: Compliant Min Qty: 1 | 0 |
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RFQ |
Part Details for HMC633
HMC633 CAD Models
HMC633 Part Data Attributes
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HMC633
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
HMC633
Analog Devices Inc
HMC633
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | DIE-7 | |
| Pin Count | 0 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Characteristic Impedance | 50 Ω | |
| Construction | COMPONENT | |
| Gain | 26 dB | |
| Input Power-Max (CW) | 5 dBm | |
| Number of Functions | 1 | |
| Operating Frequency-Max | 17000 MHz | |
| Operating Frequency-Min | 5000 MHz | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Equivalence Code | DIE OR CHIP | |
| Power Supplies | 5 V | |
| RF/Microwave Device Type | WIDE BAND MEDIUM POWER | |
| Technology | GAAS |
Alternate Parts for HMC633
This table gives cross-reference parts and alternative options found for HMC633. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HMC633, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| HMC608LC4 | Analog Devices Inc | $129.9869 | GaAs pHEMT Medium Power Amplifier, 9.5 - 11.5 GHz | HMC633 vs HMC608LC4 |
| RF2347 | RF Micro Devices Inc | Check for Price | Wide Band Low Power Amplifier, 150MHz Min, 2500MHz Max, 1 Func, GAAS, PLASTIC, MSOP-8 | HMC633 vs RF2347 |
| HMC455LP3E | Hittite Microwave Corp | Check for Price | Narrow Band Medium Power Amplifier, 1700MHz Min, 2500MHz Max, 1 Func, GAAS, 3 X 3 MM, ROHS COMPLIANT, LEADLESS, PLASTIC, SMT, QFN-16 | HMC633 vs HMC455LP3E |
| HMC324MS8G | Hittite Microwave Corp | Check for Price | Wide Band Low Power Amplifier, 0MHz Min, 3000MHz Max, 2 Func, BIPolar, ULTRA SMALL, PLASTIC, SMT, MSOP-8 | HMC633 vs HMC324MS8G |
| HMC323 | Hittite Microwave Corp | Check for Price | Wide Band Low Power Amplifier, 0MHz Min, 3000MHz Max, 1 Func, BIPolar, ULTRA SMALL, PLASTIC, SOT-26, SMT, 6 PIN | HMC633 vs HMC323 |
| HMC279MS8G | Hittite Microwave Corp | Check for Price | Wide Band Low Power Amplifier, 2500MHz Min, 4200MHz Max, GAAS, ULTRA SMALL, PLASTIC, SMT, MSOP-8 | HMC633 vs HMC279MS8G |
| HMC315E | Hittite Microwave Corp | Check for Price | Wide Band Low Power Amplifier, 0MHz Min, 7000MHz Max, 1 Func, GAAS, ROHS COMPLIANT, ULTRA SMALL, PLASTIC, SOT-26, SMT, 6 PIN | HMC633 vs HMC315E |
| HMC455LP3 | Hittite Microwave Corp | Check for Price | Narrow Band Medium Power Amplifier, 1700MHz Min, 2500MHz Max, 1 Func, GAAS, 3 X 3 MM, LEADLESS, PLASTIC, SMT, QFN-16 | HMC633 vs HMC455LP3 |
| HMC315 | Hittite Microwave Corp | Check for Price | Wide Band Low Power Amplifier, 0MHz Min, 7000MHz Max, 1 Func, BIPolar, ULTRA SMALL, PLASTIC, SOT-26, SMT, 6 PIN | HMC633 vs HMC315 |
| HMC311ST89 | Hittite Microwave Corp | Check for Price | Wide Band Low Power Amplifier, 0MHz Min, 6000MHz Max, 1 Func, BIPolar, PLASTIC, SMT, SOT-89, 3 PIN | HMC633 vs HMC311ST89 |
HMC633 Frequently Asked Questions (FAQ)
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A good PCB layout for the HMC633 involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing the device near a thermal heat sink or a metal plate for heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.
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To optimize the HMC633's performance, consider the specific requirements of your application, such as frequency range, power level, and impedance matching. Use simulation tools and modeling to optimize the device's performance and minimize losses. Additionally, consider using external components, such as filters or amplifiers, to enhance the device's performance.
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Potential sources of noise and interference in the HMC633 include electromagnetic interference (EMI), radio-frequency interference (RFI), and thermal noise. To mitigate these effects, use proper shielding, grounding, and filtering techniques, and ensure that the device is operated within its specified temperature range.
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To ensure the reliability and longevity of the HMC633, follow proper handling and storage procedures, operate the device within its specified temperature and power ranges, and avoid exposing it to mechanical stress or electrical overstress. Regularly inspect the device and surrounding components for signs of wear or damage.
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Key considerations for thermal management and heat dissipation in the HMC633 include ensuring good thermal conductivity between the device and the heat sink, using a thermal interface material (TIM) to fill gaps, and providing adequate airflow or convection to dissipate heat. The device's thermal resistance (RθJA) should be minimized to prevent overheating.