Part Details for HMC587LC4BTR by Hittite Microwave Corp
Results Overview of HMC587LC4BTR by Hittite Microwave Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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HMC587LC4BTR Information
HMC587LC4BTR by Hittite Microwave Corp is an Other Oscillator.
Other Oscillators are under the broader part category of Oscillators.
Oscillators are electronic components that produce sine or square waves in order to convert signals. Read more about Oscillators on our Oscillators part category page.
Price & Stock for HMC587LC4BTR
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Chip 1 Exchange | INSTOCK | 4 |
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Part Details for HMC587LC4BTR
HMC587LC4BTR CAD Models
HMC587LC4BTR Part Data Attributes
HMC587LC4BTR Frequently Asked Questions (FAQ)
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The recommended PCB layout and land pattern can be found in the Hittite Microwave Corp application note AN1031, which provides guidelines for designing a PCB layout that minimizes parasitic inductance and ensures optimal performance.
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The HMC587LC4BTR requires a specific biasing and configuration to operate correctly. Consult the datasheet and application notes for guidance on setting the correct voltage and current levels, as well as configuring the device for your specific frequency range and application.
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The HMC587LC4BTR has a maximum junction temperature of 150°C. Ensure proper thermal management by providing adequate heat sinking, using thermal vias, and keeping the device away from heat sources. Consult the datasheet for thermal resistance and power dissipation information.
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Common issues like oscillation or instability can be caused by improper biasing, layout, or configuration. Consult the datasheet and application notes for troubleshooting guidelines, and consider using simulation tools or seeking support from Hittite Microwave Corp or a qualified engineer.
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The HMC587LC4BTR is a sensitive device that requires proper ESD protection and handling. Follow standard ESD handling procedures, use ESD-safe materials and tools, and ensure that the device is properly grounded during handling and assembly.