Part Details for HMC470LP3E by Hittite Microwave Corp
Results Overview of HMC470LP3E by Hittite Microwave Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Telecommunications
HMC470LP3E Information
HMC470LP3E by Hittite Microwave Corp is an RF/Microwave Attenuator.
RF/Microwave Attenuators are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for HMC470LP3E
| Part # | Distributor | Description | Stock | Price | Buy | |
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NexGen Digital | 729 |
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RFQ |
Part Details for HMC470LP3E
HMC470LP3E CAD Models
HMC470LP3E Part Data Attributes
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HMC470LP3E
Hittite Microwave Corp
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Datasheet
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HMC470LP3E
Hittite Microwave Corp
Variable Attenuator, 0MHz Min, 3000MHz Max, 2dB Insertion Loss-Max, GAAS, 3 X 3 MM, ROHS COMPLIANT, LEADLESS, PLASTIC, SMT, 16 PIN
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITTITE MICROWAVE CORP | |
| Package Description | 3 X 3 MM, ROHS COMPLIANT, LEADLESS, PLASTIC, SMT, 16 PIN | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | CMOS COMPATIBLE | |
| Attenuation-Nom | 31 dB | |
| Characteristic Impedance | 50 Ω | |
| Construction | COMPONENT | |
| Input Power-Max (CW) | 26.99 dBm | |
| Insertion Loss-Max | 2 dB | |
| JESD-609 Code | e3 | |
| Mounting Feature | SURFACE MOUNT | |
| Number of Terminals | 16 | |
| Operating Frequency-Max | 3000 MHz | |
| Operating Frequency-Min | ||
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | LCC16,.12SQ,20 | |
| Power Supplies | 5 V | |
| RF/Microwave Device Type | VARIABLE ATTENUATOR | |
| Surface Mount | YES | |
| Technology | GAAS | |
| Terminal Finish | Matte Tin (Sn) |
Alternate Parts for HMC470LP3E
This table gives cross-reference parts and alternative options found for HMC470LP3E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HMC470LP3E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| HMC470ALP3E | Analog Devices Inc | $11.3445 | 0.1 GHz to 3 GHz,1 dB LSB, 5-Bit, GaAs Digital Attenuator | HMC470LP3E vs HMC470ALP3E |
| HMC470LP3E | Analog Devices Inc | Check for Price | 1dB LSB 5-Bit Digital Attenuator SMT, DC - 3 GHz | HMC470LP3E vs HMC470LP3E |
| HMC470LP3TR | Analog Devices Inc | Check for Price | 1dB LSB 5-Bit Digital Attenuator SMT, DC - 3 GHz | HMC470LP3E vs HMC470LP3TR |
| HMC470LP3RTR | Analog Devices Inc | Check for Price | IC,ATTENUATOR,GAAS,LLCC,16PIN,PLASTIC | HMC470LP3E vs HMC470LP3RTR |
| HMC470LP3 | Analog Devices Inc | Check for Price | 1dB LSB 5-Bit Digital Attenuator SMT, DC - 3 GHz | HMC470LP3E vs HMC470LP3 |
HMC470LP3E Frequently Asked Questions (FAQ)
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The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near the edge of the board to minimize thermal resistance. Thermal management involves using a heat sink or thermal pad to dissipate heat, and ensuring good airflow around the device.
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Optimizing the input and output matching networks involves using simulation software such as ADS or AWR to design and optimize the matching networks for maximum gain and efficiency. The goal is to achieve a good impedance match between the device and the external circuitry.
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The recommended soldering technique is reflow soldering, and the device should be handled and stored in a static-safe environment to prevent damage. The assembly process should ensure that the device is properly aligned and secured to the PCB, and that the solder joints are clean and free of defects.
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Troubleshooting common issues involves using a combination of measurement tools such as spectrum analyzers, oscilloscopes, and network analyzers to identify the root cause of the problem. It may also involve checking the PCB layout, component values, and solder joints for defects or errors.
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The HMC470LP3E is designed to meet the reliability and environmental testing requirements of the aerospace and defense industries, including temperature cycling, vibration, and shock testing. The device should be tested and qualified according to the relevant industry standards and specifications.