Datasheets
HMC374ETR by:

Wide Band Medium Power Amplifier, 300MHz Min, 3000MHz Max, 1 Func, ROHS COMPLIANT, PLASTIC, SMT, SOT-26, 6 PIN

Part Details for HMC374ETR by Hittite Microwave Corp

Results Overview of HMC374ETR by Hittite Microwave Corp

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HMC374ETR Information

HMC374ETR by Hittite Microwave Corp is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.

RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.

Price & Stock for HMC374ETR

Part # Distributor Description Stock Price Buy
Quest Components WIDE BAND MEDIUM POWER AMPLIFIER, 300MHZ MIN, 3000MHZ MAX, 1 FUNC 139
  • 1 $9.4800
  • 12 $6.3200
  • 41 $5.8460
$5.8460 / $9.4800 Buy Now

Part Details for HMC374ETR

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HMC374ETR Part Data Attributes

HMC374ETR Hittite Microwave Corp
Buy Now Datasheet
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HMC374ETR Hittite Microwave Corp Wide Band Medium Power Amplifier, 300MHz Min, 3000MHz Max, 1 Func, ROHS COMPLIANT, PLASTIC, SMT, SOT-26, 6 PIN
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer HITTITE MICROWAVE CORP
Package Description ROHS COMPLIANT, PLASTIC, SMT, SOT-26, 6 PIN
Reach Compliance Code unknown
Characteristic Impedance 50 Ω
Construction COMPONENT
Gain 6 dB
Input Power-Max (CW) 15 dBm
Mounting Feature SURFACE MOUNT
Number of Functions 1
Number of Terminals 6
Operating Frequency-Max 3000 MHz
Operating Frequency-Min 300 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TSOP6,.11,37
Power Supplies 5 V
RF/Microwave Device Type WIDE BAND MEDIUM POWER
Surface Mount YES

HMC374ETR Related Parts

HMC374ETR Frequently Asked Questions (FAQ)

  • The recommended PCB layout and thermal management for the HMC374ETR involve using a 4-layer PCB with a solid ground plane, placing the device near the edge of the board, and using thermal vias to dissipate heat. A heat sink or thermal pad can also be used to improve thermal performance.

  • Optimizing the input and output matching networks for the HMC374ETR involves using a combination of simulation tools and empirical methods to achieve the best possible impedance match. This may involve using a network analyzer to measure the device's S-parameters and then using a simulation tool to design the matching networks.

  • Potential sources of noise in the HMC374ETR include thermal noise, shot noise, and electromagnetic interference (EMI). These can be mitigated by using a low-noise power supply, shielding the device from EMI, and using a low-noise amplifier in the signal chain.

  • Ensuring the HMC374ETR is biased correctly involves following the recommended biasing scheme outlined in the datasheet, using a voltage regulator to provide a stable voltage supply, and monitoring the device's current consumption to prevent overheating.

  • The reliability and MTBF expectations for the HMC374ETR are typically specified in the device's reliability report, which can be obtained from the manufacturer. In general, the device is designed to meet the reliability requirements of high-reliability applications such as aerospace and defense.

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