Datasheets
HD3SS3415RUAT by:

3.3-V PCI Express 3.0, USB 3.1 4-channel analog differential switch 42-WQFN 0 to 70

Part Details for HD3SS3415RUAT by Texas Instruments

Results Overview of HD3SS3415RUAT by Texas Instruments

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Applications Consumer Electronics

HD3SS3415RUAT Information

HD3SS3415RUAT by Texas Instruments is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Price & Stock for HD3SS3415RUAT

Part # Distributor Description Stock Price Buy
DISTI # 296-41415-1-ND
DigiKey IC MUX 2:1 8 OHM 42WQFN Min Qty: 1 Lead time: 18 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) 17142
In Stock
  • 1 $2.4000
  • 10 $1.7820
  • 25 $1.6276
  • 100 $1.4576
  • 250 $1.1700
  • 500 $1.1285
  • 750 $1.1275
$1.1275 / $2.4000 Buy Now
DISTI # 595-HD3SS3415RUAT
Mouser Electronics PCI Interface IC 4-Channel High-Perf 10Gbps Diff Switch A 595-HD3SS3415RUAR RoHS: Compliant 864
  • 1 $2.4000
  • 10 $1.7900
  • 25 $1.6300
  • 100 $1.4600
  • 250 $1.1700
  • 500 $1.1200
$1.1200 / $2.4000 Buy Now
Chip-Germany GmbH   RoHS: Not Compliant 147
RFQ
Cytech Systems Limited IC MUX 2:1 8 OHM 42WQFN 4750
RFQ
Vyrian Other Function Semiconductors 6504
RFQ

Part Details for HD3SS3415RUAT

HD3SS3415RUAT CAD Models

HD3SS3415RUAT Part Data Attributes

HD3SS3415RUAT Texas Instruments
Buy Now Datasheet
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HD3SS3415RUAT Texas Instruments 3.3-V PCI Express 3.0, USB 3.1 4-channel analog differential switch 42-WQFN 0 to 70
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Package Description QFN-42
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Analog IC - Other Type DIFFERENTIAL MULTIPLEXER
Bandwidth-Nom 8000 MHz
JESD-30 Code R-PQCC-N42
JESD-609 Code e4
Length 9 mm
Moisture Sensitivity Level 2
Normal Position NO
Number of Channels 4
Number of Functions 1
Number of Terminals 42
Off-state Isolation-Nom 75 dB
On-state Resistance Match-Nom 2 Ω
On-state Resistance-Max (Ron) 8 Ω
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC42,.14X.35,20
Package Shape RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Supply Current-Max (Isup) 0.0036 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Switch-off Time-Max 0.085 ns
Switch-on Time-Max 0.085 ns
Temperature Grade COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 3.5 mm

HD3SS3415RUAT Related Parts

HD3SS3415RUAT Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes. Use a common mode filter or a ferrite bead to reduce EMI.

  • The HD3SS3415RUAT requires a 1.8V to 3.3V power supply. Ensure that the power supply is stable and clean. Power sequencing is not critical, but it's recommended to power up the VCC pin first, followed by the VCCIO pin.

  • The HD3SS3415RUAT supports data transfer rates up to 10 Gbps. However, the actual data transfer rate may be limited by the system's bandwidth, signal integrity, and PCB design.

  • Use an oscilloscope to check the signal integrity and eye diagrams. Verify that the power supply is stable and clean. Check the PCB design and layout for any signal integrity issues. Use a logic analyzer to debug the data transfer protocol.

  • Yes, the HD3SS3415RUAT has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid blocking the airflow around the device.

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