Part Details for HCTL-2017-A00 by Broadcom Limited
Results Overview of HCTL-2017-A00 by Broadcom Limited
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Industrial Automation
Aerospace and Defense
Agriculture Technology
Robotics and Drones
HCTL-2017-A00 Information
HCTL-2017-A00 by Broadcom Limited is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| TPD2017FN | Toshiba Electronic Devices & Storage Corporation | Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30 |
Price & Stock for HCTL-2017-A00
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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Cytech Systems Limited | IC INTERFACE SPECIALIZED 16DIP | 1250 |
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RFQ | |
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DISTI #
HCTL-2017-A00
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EBV Elektronik | Quadrature DecoderCounter Interface IC 16Pin PDIP (Alt: HCTL-2017-A00) RoHS: Compliant Min Qty: 50 Package Multiple: 50 | EBV - 0 |
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Buy Now | |
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Vyrian | Interface ICs | 1605 |
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RFQ | |
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Win Source Electronics | IC DECODER/COUNTER 16BIT 16-DIP | 150 |
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$222.0528 / $247.6743 | Buy Now |
Part Details for HCTL-2017-A00
HCTL-2017-A00 CAD Models
HCTL-2017-A00 Part Data Attributes
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HCTL-2017-A00
Broadcom Limited
Buy Now
Datasheet
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Compare Parts:
HCTL-2017-A00
Broadcom Limited
Interface Circuit, CMOS, PDIP16, PLASTIC, DIP-16
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | BROADCOM INC | |
| Package Description | PLASTIC, DIP-16 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | R-PDIP-T16 | |
| JESD-609 Code | e3 | |
| Length | 26.162 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.45 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
HCTL-2017-A00 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode choke or ferrite bead to filter out noise on the power lines.
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Use a thermal management strategy such as heat sinks, thermal pads, or thermal interfaces to keep the junction temperature below 125°C. Ensure good airflow and avoid blocking airflow around the device.
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Use a metal shield or a conductive enclosure to enclose the device. Ensure good contact between the shield and the PCB ground plane. Use EMI filters or common mode chokes on the input/output lines to reduce emissions.
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Ensure that the power supplies are sequenced correctly, with the analog supply (VCCA) powered up before the digital supply (VCCD). Use a power sequencing controller or a dedicated power management IC to manage the power-up sequence.
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Use controlled impedance traces (50-60 ohms) for high-speed signals. Keep the traces short and away from noise sources. Use a signal integrity analysis tool to optimize the layout and routing.