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SPECIALTY INTERFACE CIRCUIT, PDIP16, PLASTIC, DIP-16
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
HCTL-2017-A00 by Avago Technologies is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
TPD2017FN | Toshiba Electronic Devices & Storage Corporation | Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30 | |
TPS72017YZUR | Texas Instruments | 350mA Ultra-Low-Vin, RF Low-Dropout (LDO) Linear Regulator With Bias Pin 5-DSBGA -40 to 125 | |
TSC2017IYZGR | Texas Instruments | Nanopower, 4-Wire, Micro Touch Screen Controller with I2C™ Interface 12-DSBGA -40 to 85 |
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
70157750
|
RS | QUADRATURE DECODER IC,16BIT, PDIP Min Qty: 10 Package Multiple: 1 Container: Bulk | 0 |
|
$17.9500 | RFQ |
|
Quest Components | MANUFACTURER SUPPLIED STATUS INFORMATION | 2 |
|
$17.4818 | Buy Now |
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HCTL-2017-A00
Avago Technologies
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Datasheet
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HCTL-2017-A00
Avago Technologies
SPECIALTY INTERFACE CIRCUIT, PDIP16, PLASTIC, DIP-16
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | AVAGO TECHNOLOGIES INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP16,.3 | |
Pin Count | 16 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Avago Technologies | |
Interface IC Type | INTERFACE CIRCUIT | |
JESD-30 Code | R-PDIP-T16 | |
JESD-609 Code | e3 | |
Length | 26.162 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP16,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.45 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode choke or ferrite bead to filter out noise on the power lines.
Use a thermal management strategy such as heat sinks, thermal pads, or thermal interfaces to keep the junction temperature below 125°C. Ensure good airflow and avoid blocking airflow around the device.
Use a metal shield or a conductive enclosure to enclose the device. Ensure good contact between the shield and the PCB ground plane. Use EMI filters or common mode chokes on the input/output lines to reduce emissions.
Ensure that the power supplies are sequenced correctly, with the analog supply (VCCA) powered up before the digital supply (VCCD). Use a power sequencing controller or a dedicated power management IC to manage the power-up sequence.
Use controlled impedance traces (50-60 ohms) for high-speed signals. Keep the traces short and away from noise sources. Use a signal integrity analysis tool to optimize the layout and routing.