Part Details for HCB2012KF-221T20 by Tai-Tech Advanced Electronics Co Ltd
Results Overview of HCB2012KF-221T20 by Tai-Tech Advanced Electronics Co Ltd
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Computing and Data Storage
HCB2012KF-221T20 Information
HCB2012KF-221T20 by Tai-Tech Advanced Electronics Co Ltd is a Data Line Filter.
Data Line Filters are under the broader part category of Filters.
A filter is an electronic circuit that selectively allows certain frequencies to pass while attenuating others. They are used to extract desired signals and remove noise. Read more about Filters on our Filters part category page.
Price & Stock for HCB2012KF-221T20
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 73793 |
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RFQ |
Part Details for HCB2012KF-221T20
HCB2012KF-221T20 CAD Models
HCB2012KF-221T20 Part Data Attributes
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HCB2012KF-221T20
Tai-Tech Advanced Electronics Co Ltd
Buy Now
Datasheet
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Compare Parts:
HCB2012KF-221T20
Tai-Tech Advanced Electronics Co Ltd
Ferrite Chip, 1 Function(s), 2A, 2 Pin(s),
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TAI-TECH ADVANCED ELECTRONICS CO LTD | |
| Reach Compliance Code | compliant | |
| DC Resistance-Max | 0.1 Ω | |
| Filter Type | FERRITE CHIP | |
| Height | 0.85 mm | |
| Length | 2 mm | |
| Mounting Type | SURFACE MOUNT | |
| Number of Functions | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Impedance | 220 OHM Ω | |
| Packing Method | TR | |
| Rated Current | 2 A | |
| Width | 1.25 mm |
Alternate Parts for HCB2012KF-221T20
This table gives cross-reference parts and alternative options found for HCB2012KF-221T20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HCB2012KF-221T20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MPZ2012S601AT000 | TDK Corporation | $0.0405 | Ferrite Chip, 1 Function(s), 2A, | HCB2012KF-221T20 vs MPZ2012S601AT000 |
| MPZ2012S601A | TDK Corporation | $0.0605 | Ferrite Chip, 1 Function(s), 2A, ROHS COMPLIANT, SMD, 2 PIN | HCB2012KF-221T20 vs MPZ2012S601A |
| MPZ2012S601AT | TDK Corporation | Check for Price | Ferrite Chip, 1 Function(s), 2A, EIA STD PACKAGE SIZE 0805, 2 PIN | HCB2012KF-221T20 vs MPZ2012S601AT |
| WLBD2012HCU221TB | Walsin Technology Corporation | Check for Price | Ferrite Chip | HCB2012KF-221T20 vs WLBD2012HCU221TB |
| WLBD2012HCU121TB | Walsin Technology Corporation | Check for Price | Ferrite Chip | HCB2012KF-221T20 vs WLBD2012HCU121TB |
| ACML-0805H-121-T | Abracon Corporation | Check for Price | Ferrite Bead, 1 Function(s), 2A, ROHS COMPLIANT, EIA STD PACKAGE SIZE 0805, 2 PIN | HCB2012KF-221T20 vs ACML-0805H-121-T |
| WLBD2012HCU151TB | Walsin Technology Corporation | Check for Price | Ferrite Chip | HCB2012KF-221T20 vs WLBD2012HCU151TB |
HCB2012KF-221T20 Frequently Asked Questions (FAQ)
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The recommended land pattern for HCB2012KF-221T20 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
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While the HCB2012KF-221T20 is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component is not exposed to temperatures above 110°C for extended periods. Additionally, the PCB material and soldering process should be designed to withstand high temperatures.
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The HCB2012KF-221T20 is a moisture-sensitive device (MSD). To prevent damage, it's crucial to store the components in a dry environment (less than 30% RH) and follow the recommended baking and handling procedures before soldering.
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The recommended soldering profile for HCB2012KF-221T20 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow a controlled soldering process to prevent thermal shock and ensure reliable connections.
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While the HCB2012KF-221T20 is designed to withstand some vibration, it's essential to consider the specific vibration profile and ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method.