Part Details for HC9-6R8-R by Eaton Electronics
Results Overview of HC9-6R8-R by Eaton Electronics
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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HC9-6R8-R Information
HC9-6R8-R by Eaton Electronics is a Fixed Inductor.
Fixed Inductors are under the broader part category of Inductors.
Inductors are passive components that resist sudden changes in current by storing and releasing energy in an electromagnetic fiel. They are often used in power circuits and energy storage. Read more about Inductors on our Inductors part category page.
Price & Stock for HC9-6R8-R
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
70038037
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RS | Inductor, High Current Power Inductor, 6.8uH, 15.1A, 9.4 mOhms Min Qty: 1 Package Multiple: 1 Lead time: 39 Weeks, 0 Days Container: Bulk | 43 |
|
$1.4700 | Buy Now |
|
DISTI #
HC9-6R8-R
|
TME | Inductor: wire, SMD, 7.45uH, Ioper: 10.3A, 9.4mΩ, ±15%, Isat: 11.4A Min Qty: 450 | 0 |
|
$2.0500 | RFQ |
Part Details for HC9-6R8-R
HC9-6R8-R CAD Models
HC9-6R8-R Part Data Attributes
HC9-6R8-R Frequently Asked Questions (FAQ)
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The recommended land pattern for the HC9-6R8-R is a rectangular pad with dimensions of 3.8mm x 2.5mm, with a 1.1mm diameter hole in the center for the pin.
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The HC9-6R8-R is rated for operation up to 125°C, but derating is required above 85°C. Consult the datasheet for specific derating guidelines.
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The HC9-6R8-R is a lead-free component and can be soldered using a standard reflow soldering process. Ensure that the component is properly aligned and the soldering temperature does not exceed 260°C.
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The self-resonant frequency of the HC9-6R8-R is approximately 150 MHz, but this can vary depending on the specific application and PCB layout.
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The HC9-6R8-R is rated for a maximum current of 1.3A, but this can be affected by the operating temperature and other factors. Consult the datasheet for specific current handling guidelines.