Part Details for GS832272C-133I by GSI Technology
Results Overview of GS832272C-133I by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
GS832272C-133I Information
GS832272C-133I by GSI Technology is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for GS832272C-133I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS832272C-133I
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Avnet Americas | SRAM Chip Sync Octal 2.5V/3.3V 36M-Bit 512K x 72-Bit 8.5ns/4ns 209-Pin FBGA Tray - Trays (Alt: GS832272C-133I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
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$65.3562 / $69.8250 | Buy Now |
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DISTI #
464-GS832272C-133I
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Mouser Electronics | SRAM 2.5 or 3.3V 512K x 72 36M | 0 |
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$84.5200 / $91.9000 | Order Now |
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DISTI #
GS832272C-133I
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Avnet Silica | SRAM Chip Sync Octal 25V33V 36MBit 512K x 72Bit 85ns4ns 209Pin FBGA Tray (Alt: GS832272C-133I) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 9 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for GS832272C-133I
GS832272C-133I CAD Models
GS832272C-133I Part Data Attributes
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GS832272C-133I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS832272C-133I
GSI Technology
Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA209,11X19,40 | |
| Pin Count | 209 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Samacsys Manufacturer | GSI TECHNOLOGY | |
| Access Time-Max | 8.5 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B209 | |
| Length | 22 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 72 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 209 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX72 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA209,11X19,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Standby Current-Max | 0.08 A | |
| Standby Voltage-Min | 2.38 V | |
| Supply Current-Max | 0.255 mA | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |
Alternate Parts for GS832272C-133I
This table gives cross-reference parts and alternative options found for GS832272C-133I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS832272C-133I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| GS832272C-133 | GSI Technology | Check for Price | Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GS832272C-133I vs GS832272C-133 |
| GS832272GC-133 | GSI Technology | Check for Price | Cache SRAM, 512KX72, 8.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209 | GS832272C-133I vs GS832272GC-133 |
GS832272C-133I Frequently Asked Questions (FAQ)
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The GS832272C-133I can operate from -40°C to +85°C, making it suitable for industrial and commercial applications.
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It's recommended to power up VDD and VDDQ simultaneously, and power down VDDQ before VDD. Also, ensure that the input signals are stable before applying power.
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GSI Technology recommends using a 50-ohm termination resistor in series with a 10-ohm resistor to VTT (midpoint of VDD and VSS) for each output signal.
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Yes, the GS832272C-133I is clock-frequency flexible, but you'll need to ensure that the clock frequency is within the specified range (133 MHz) and that the system meets the required setup and hold times.
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Use proper PCB layout techniques, such as separating signal lines, using ground planes, and adding decoupling capacitors to minimize SSN. Also, consider using a bus-hold circuit or a series resistor to prevent bus contention.