Part Details for GS1574ACNE3 by Semtech Corporation
Results Overview of GS1574ACNE3 by Semtech Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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GS1574ACNE3 Information
GS1574ACNE3 by Semtech Corporation is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for GS1574ACNE3
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
06X0095
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Newark | Qfn 16L 4Mm X 4Mm |Semtech GS1574ACNE3 RoHS: Not Compliant Min Qty: 490 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$21.4200 | Buy Now |
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DISTI #
GS1574ACNE3-ND
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DigiKey | IC VIDEO CABLE EQUALIZER 16QFN Min Qty: 1 Lead time: 24 Weeks Container: Tray |
252 In Stock |
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$19.6875 / $30.4400 | Buy Now |
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DISTI #
GS1574ACNE3
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Avnet Silica | (Alt: GS1574ACNE3) RoHS: Compliant Min Qty: 490 Package Multiple: 490 | Silica - 0 |
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Buy Now |
Part Details for GS1574ACNE3
GS1574ACNE3 CAD Models
GS1574ACNE3 Part Data Attributes
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GS1574ACNE3
Semtech Corporation
Buy Now
Datasheet
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GS1574ACNE3
Semtech Corporation
Telecom Circuit, 1-Func, BICMOS, 4 X 4 MM, ROHS COMPLIANT, MO-220, QFN-16
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SEMTECH CORP | |
| Part Package Code | QFN | |
| Package Description | 4 X 4 MM, ROHS COMPLIANT, MO-220, QFN-16 | |
| Pin Count | 16 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | SEMTECH | |
| JESD-30 Code | S-XQCC-N16 | |
| JESD-609 Code | e3 | |
| Length | 4 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 4 mm |
GS1574ACNE3 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. Use thermal pads or a heat sink for high-power applications.
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Use the lowest possible supply voltage, disable unused features, and optimize the clock frequency. Consider using the device's power-down modes and adjusting the bias current for further power reduction.
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Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and store the device in an anti-static bag. Follow standard ESD handling procedures for sensitive electronics.
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The GS1574ACNE3 is not specifically designed for radiation-intensive environments. However, it may still be used in such environments with proper shielding and radiation-hardened design considerations. Consult with a radiation expert for specific guidance.
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The device has a maximum junction temperature of 150°C. Derate the power dissipation by 2.5mW/°C above 25°C. Ensure proper thermal management to prevent overheating and reduce the risk of thermal shutdown.