Part Details for GDPXA255A0E200 by Intel Corporation
Results Overview of GDPXA255A0E200 by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
GDPXA255A0E200 Information
GDPXA255A0E200 by Intel Corporation is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for GDPXA255A0E200
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | HIGH PERFORMANCE PROCESSOR Microprocessor, 32-Bit, 200MHz, CMOS, PBGA256 RoHS: Not Compliant |
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RFQ |
Part Details for GDPXA255A0E200
GDPXA255A0E200 CAD Models
GDPXA255A0E200 Part Data Attributes
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GDPXA255A0E200
Intel Corporation
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Datasheet
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GDPXA255A0E200
Intel Corporation
Microprocessor, 32-Bit, 200MHz, CMOS, PBGA256, 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-256
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1.75 MM HEIGHT, PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 3.6864 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| Length | 17 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Speed | 200 MHz | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Alternate Parts for GDPXA255A0E200
This table gives cross-reference parts and alternative options found for GDPXA255A0E200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GDPXA255A0E200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| IBM25PPC750CXEJQ5013T | IBM | Check for Price | RISC Microprocessor, 32-Bit, 500MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 | GDPXA255A0E200 vs IBM25PPC750CXEJQ5013T |
| MCF5235CVM100 | NXP Semiconductors | Check for Price | 32-BIT, 100MHz, RISC PROCESSOR, PBGA256 | GDPXA255A0E200 vs MCF5235CVM100 |
| MPC604ARX100 | Motorola Mobility LLC | Check for Price | 32-BIT, 100MHz, RISC PROCESSOR, PBGA256, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-256 | GDPXA255A0E200 vs MPC604ARX100 |
| KMPC870ZT80 | Freescale Semiconductor | Check for Price | 32-BIT, 80MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | GDPXA255A0E200 vs KMPC870ZT80 |
| XPC823CZT66B2T | Freescale Semiconductor | Check for Price | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256 | GDPXA255A0E200 vs XPC823CZT66B2T |
| MPC852TZT80A | NXP Semiconductors | Check for Price | 32-BIT, 80MHz, RISC PROCESSOR, PBGA256 | GDPXA255A0E200 vs MPC852TZT80A |
| XPC823ZT50 | Motorola Mobility LLC | Check for Price | 32-BIT, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256 | GDPXA255A0E200 vs XPC823ZT50 |
| MPC870CZT66 | NXP Semiconductors | Check for Price | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256 | GDPXA255A0E200 vs MPC870CZT66 |
| KMPC875VR66 | Freescale Semiconductor | Check for Price | 32-BIT, 66 MHz, RISC PROCESSOR, PBGA256, LEAD FREE, PLASTIC, BGA-256 | GDPXA255A0E200 vs KMPC875VR66 |
| MPC823ZC50 | Motorola Semiconductor Products | Check for Price | RISC Microprocessor, 32-Bit, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 | GDPXA255A0E200 vs MPC823ZC50 |
GDPXA255A0E200 Frequently Asked Questions (FAQ)
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Intel provides a reference design guide for the GDPXA255A0E200, which includes recommendations for PCB layout, thermal design, and heat sink selection. It's essential to follow these guidelines to ensure optimal performance and prevent overheating.
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Intel recommends using a power management IC (PMIC) specifically designed for the GDPXA255A0E200. The PMIC should be able to provide the required voltage rails, power sequencing, and voltage regulation. Intel provides a list of recommended PMICs in the datasheet.
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The GDPXA255A0E200 requires a high-quality clock signal with specific frequency, amplitude, and jitter requirements. Intel recommends using a clock generator or oscillator that meets these requirements. Additionally, it's essential to ensure clock signal integrity by using proper PCB layout techniques, such as using a dedicated clock trace and minimizing signal reflections.
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Intel provides a software development kit (SDK) and firmware development guidelines for the GDPXA255A0E200. By following these guidelines and optimizing the firmware and software for the specific use case, engineers can achieve maximum performance and efficiency.
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Intel provides reliability and durability data for the GDPXA255A0E200 in the datasheet, including operating temperature range, humidity, and vibration tolerance. Engineers should ensure that their design meets these requirements and takes into account any additional environmental factors that may affect the device's performance and lifespan.