Part Details for FSV1550V by Fairchild Semiconductor Corporation
Results Overview of FSV1550V by Fairchild Semiconductor Corporation
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FSV1550V Information
FSV1550V by Fairchild Semiconductor Corporation is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for FSV1550V
FSV1550V CAD Models
FSV1550V Part Data Attributes
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FSV1550V
Fairchild Semiconductor Corporation
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Datasheet
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FSV1550V
Fairchild Semiconductor Corporation
Rectifier Diode, Schottky, 1 Phase, 1 Element, 50V V(RRM), Silicon, TO-277,
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | TO-277 | |
| Pin Count | 3 | |
| Manufacturer Package Code | 3LD, TO277, JEDEC, SURFACE MOUNT | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Application | GENERAL PURPOSE | |
| Case Connection | CATHODE | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 0.51 V | |
| JEDEC-95 Code | TO-277 | |
| JESD-30 Code | R-PDSO-F3 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 300 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Current-Max | 15 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Rep Pk Reverse Voltage-Max | 50 V | |
| Reverse Current-Max | 320 µA | |
| Surface Mount | YES | |
| Technology | SCHOTTKY | |
| Terminal Form | FLAT | |
| Terminal Position | DUAL |
FSV1550V Frequently Asked Questions (FAQ)
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A good PCB layout for the FSV1550V involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
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Proper thermal management of the FSV1550V involves providing a heat sink with a thermal resistance of less than 10°C/W, ensuring good airflow around the device, and keeping the ambient temperature below 70°C. A thermal interface material can be used to improve heat transfer between the device and the heat sink.
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Exceeding the maximum junction temperature of the FSV1550V can lead to reduced reliability, decreased performance, and even permanent damage to the device. It can also cause the device to enter thermal shutdown, which can affect system operation.
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To troubleshoot issues with the FSV1550V, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature rise or thermal shutdown. Use an oscilloscope to check for output voltage ripple or oscillations.
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Yes, the FSV1550V is suitable for high-reliability and high-availability applications. It has a high mean time between failures (MTBF) and is designed to meet the requirements of demanding applications such as industrial control systems, medical devices, and aerospace systems.