Part Details for FSFR1700XSL by onsemi
Results Overview of FSFR1700XSL by onsemi
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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FSFR1700XSL Information
FSFR1700XSL by onsemi is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for FSFR1700XSL
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
27T6501
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Newark | High Pwr Fps For Hb/Tube |Onsemi FSFR1700XSL RoHS: Not Compliant Min Qty: 114 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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DISTI #
FSFR1700XSL-ND
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DigiKey | IC OFFLINE SW HALF-BRIDGE 9SIP Min Qty: 1 Lead time: 99 Weeks Container: Tube, Tube |
377 In Stock |
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$2.0387 / $5.0400 | Buy Now |
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Rochester Electronics | Half Bridge Based Peripheral Driver RoHS: Compliant Status: Active Min Qty: 1 | 380 |
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$1.5100 / $1.8900 | Buy Now |
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DISTI #
FSFR1700XSL
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Avnet Silica | Power Switch Hi SideLo Side 6A 9Pin SIP Rail (Alt: FSFR1700XSL) RoHS: Compliant Min Qty: 19 Package Multiple: 19 Lead time: 143 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
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LCSC | SIP-9 AC-DC Controllers and Regulators ROHS | 77 |
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$2.7745 / $3.1125 | Buy Now |
Part Details for FSFR1700XSL
FSFR1700XSL CAD Models
FSFR1700XSL Part Data Attributes
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FSFR1700XSL
onsemi
Buy Now
Datasheet
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FSFR1700XSL
onsemi
Integrated Power Switch (FPS™) for 200W Half-Bridge Resonant Converter, SIP-9, 380-TUBE
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | SIP-9 | |
| Package Description | SIP-9 | |
| Manufacturer Package Code | 127EN | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | onsemi |
FSFR1700XSL Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
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Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's current handling capability at high temperatures.
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The maximum allowable voltage stress is 1.5 times the rated voltage (1700V) for a short duration (<1ms). Prolonged exposure to high voltage stress can reduce the device's lifespan.
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Yes, but ensure that the devices are matched in terms of current handling capability and thermal performance. Also, consider the increased current handling capability and thermal management requirements.
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Use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) in parallel with the device to protect it from EOS. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).