Part Details for FSFR1700XS by Fairchild Semiconductor Corporation
Results Overview of FSFR1700XS by Fairchild Semiconductor Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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FSFR1700XS Information
FSFR1700XS by Fairchild Semiconductor Corporation is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for FSFR1700XS
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-FSFR1700XS-ND
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DigiKey | IC OFFLINE SW HALF-BRIDGE 9SIP Min Qty: 123 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
8685 In Stock |
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$2.4500 | Buy Now |
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Rochester Electronics | Half Bridge Based Peripheral Driver RoHS: Compliant Status: Active Min Qty: 1 | 8742 |
|
$1.8900 / $2.3600 | Buy Now |
Part Details for FSFR1700XS
FSFR1700XS CAD Models
FSFR1700XS Part Data Attributes
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FSFR1700XS
Fairchild Semiconductor Corporation
Buy Now
Datasheet
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Compare Parts:
FSFR1700XS
Fairchild Semiconductor Corporation
Half Bridge Based Peripheral Driver, PZFM9, SIP-9
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | SIP | |
| Package Description | SIP-9 | |
| Pin Count | 9 | |
| Manufacturer Package Code | 9LD, SIP MODULE, FORMED, LEAD, 3.2X10.5X26MM (FORMERLY SIPMODAA09) | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.95 |
FSFR1700XS Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the FSFR1700XS is -40°C to 150°C.
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To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive interface material, and keeping the device within the recommended operating temperature range.
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To minimize EMI, it's recommended to use a multi-layer PCB with a solid ground plane, keep the device away from noise sources, and use shielding or filtering components as needed.
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The FSFR1700XS is rated for a maximum voltage of 1700V. If your application requires higher voltages, you may need to consider a different device or add external voltage protection components.
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To protect the device, use voltage regulators, overvoltage protection (OVP) circuits, and overcurrent protection (OCP) circuits as needed. Additionally, ensure that the device is operated within its recommended specifications.