Part Details for FS500R17OE4DPBOSA1 by Infineon Technologies AG
Results Overview of FS500R17OE4DPBOSA1 by Infineon Technologies AG
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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FS500R17OE4DPBOSA1 Information
FS500R17OE4DPBOSA1 by Infineon Technologies AG is an IGBT.
IGBTs are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for FS500R17OE4DPBOSA1
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-FS500R17OE4DPBOSA1-448-ND
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DigiKey | IGBT MOD 1700V 1000A 20MW Min Qty: 1 Lead time: 14 Weeks Container: Bulk MARKETPLACE PRODUCT |
612 In Stock |
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$648.3000 | Buy Now |
DISTI #
FS500R17OE4DPBOSA1-ND
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DigiKey | IGBT MOD 1700V 1000A 20MW Min Qty: 1 Lead time: 14 Weeks Container: Tray | Temporarily Out of Stock |
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$653.0500 | Buy Now |
DISTI #
FS500R17OE4DPBOSA1
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Avnet Americas | IGBTs - Trays (Alt: FS500R17OE4DPBOSA1) RoHS: Compliant Min Qty: 4 Package Multiple: 4 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
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$726.1916 | Buy Now |
DISTI #
85982755
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Verical | Econo PACK™ module with Trench/Field stop IGBT4 and Emitter Controlled 3 diode and PressFIT/ pre-applied Thermal Interface Material Min Qty: 1 Package Multiple: 1 Date Code: 2201 | Americas - 4 |
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$779.2125 | Buy Now |
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Rochester Electronics | FS450R17 - IGBT Module RoHS: Compliant Status: Active Min Qty: 1 | 612 |
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$548.5700 / $623.3700 | Buy Now |
DISTI #
SP001004830
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EBV Elektronik | IGBTs (Alt: SP001004830) RoHS: Compliant Min Qty: 4 Package Multiple: 4 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for FS500R17OE4DPBOSA1
FS500R17OE4DPBOSA1 CAD Models
FS500R17OE4DPBOSA1 Part Data Attributes
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FS500R17OE4DPBOSA1
Infineon Technologies AG
Buy Now
Datasheet
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FS500R17OE4DPBOSA1
Infineon Technologies AG
Insulated Gate Bipolar Transistor, 1700V V(BR)CES, N-Channel, MODULE-29
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | MODULE-29 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Factory Lead Time | 14 Weeks | |
Samacsys Manufacturer | Infineon | |
Case Connection | ISOLATED | |
Collector-Emitter Voltage-Max | 1700 V | |
Configuration | 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | |
JESD-30 Code | R-XUFM-X29 | |
Number of Elements | 6 | |
Number of Terminals | 29 | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | FLANGE MOUNT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Polarity/Channel Type | N-CHANNEL | |
Reference Standard | UL RECOGNIZED | |
Surface Mount | NO | |
Terminal Form | UNSPECIFIED | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Transistor Application | POWER CONTROL | |
Transistor Element Material | SILICON | |
Turn-off Time-Nom (toff) | 1080 ns | |
Turn-on Time-Nom (ton) | 330 ns |
FS500R17OE4DPBOSA1 Frequently Asked Questions (FAQ)
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Infineon provides a dedicated application note (AN2014-03) that outlines the recommended PCB layout and thermal design guidelines for the FS500R17OE4DPBOSA1. It's essential to follow these guidelines to ensure optimal performance, reliability, and thermal management.
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The selection of a suitable gate driver depends on the specific application requirements. Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the IGBT's gate-emitter voltage. The driver should also provide galvanic isolation and have a suitable propagation delay. Infineon's 1EDI60N12AF and 1EDI60N12AS are suitable gate driver options.
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The FS500R17OE4DPBOSA1 has a maximum allowed overcurrent of 2.5 times the nominal current (Ic) for a duration of 10ms. The maximum allowed overvoltage is 1.5 times the nominal voltage (Vce) for a duration of 10ms. Exceeding these limits can lead to device damage or failure.
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To ensure EMC, follow Infineon's guidelines for PCB layout, component placement, and shielding. Use a common mode choke and a suitable filter to reduce electromagnetic interference (EMI). Additionally, ensure that the IGBT module is properly decoupled from the power supply and other components.
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For high-power applications, a forced air cooling system or a liquid cooling system is recommended. The cooling system should be designed to maintain a junction temperature (Tj) below 125°C. Infineon provides thermal simulation models and application notes to help with thermal design and optimization.