Datasheets
FQB33N10TM by:

Power MOSFET, N-Channel, QFET®, 100 V, 33 A, 52 mΩ, D2PAK, D2PAK-3 / TO-263-2, 800-REEL

Part Details for FQB33N10TM by onsemi

Results Overview of FQB33N10TM by onsemi

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Applications Consumer Electronics Energy and Power Systems Renewable Energy

FQB33N10TM Information

FQB33N10TM by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for FQB33N10TM

Part # Distributor Description Stock Price Buy
DISTI # FQB33N10TM
TME Transistor: N-MOSFET, unipolar, 100V, 23A, 127W, D2PAK Min Qty: 1 0
  • 1 $1.1400
  • 5 $1.0000
  • 25 $0.8800
  • 100 $0.8000
  • 800 $0.7500
$0.7500 / $1.1400 RFQ
DISTI # FQB33N10TM
Avnet Silica Trans MOSFET NCH 100V 33A 3Pin2Tab D2PAK TR (Alt: FQB33N10TM) RoHS: Compliant Min Qty: 800 Package Multiple: 800 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
DISTI # FQB33N10TM
EBV Elektronik Trans MOSFET NCH 100V 33A 3Pin2Tab D2PAK TR (Alt: FQB33N10TM) RoHS: Compliant Min Qty: 800 Package Multiple: 800 Lead time: 143 Weeks, 0 Days EBV - 0
Buy Now

Part Details for FQB33N10TM

FQB33N10TM CAD Models

FQB33N10TM Part Data Attributes

FQB33N10TM onsemi
Buy Now Datasheet
Compare Parts:
FQB33N10TM onsemi Power MOSFET, N-Channel, QFET®, 100 V, 33 A, 52 mΩ, D2PAK, D2PAK-3 / TO-263-2, 800-REEL
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ONSEMI
Part Package Code D2PAK-3 / TO-263-2
Package Description D2PAK-3
Manufacturer Package Code 418AJ
Reach Compliance Code not_compliant
ECCN Code EAR99
Factory Lead Time 2 Days
Samacsys Manufacturer onsemi
Avalanche Energy Rating (Eas) 435 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 100 V
Drain Current-Max (ID) 33 A
Drain-source On Resistance-Max 0.052 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-263AB
JESD-30 Code R-PSSO-G2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 245
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 127 W
Pulsed Drain Current-Max (IDM) 132 A
Qualification Status Not Qualified
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
Transistor Element Material SILICON

Alternate Parts for FQB33N10TM

This table gives cross-reference parts and alternative options found for FQB33N10TM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FQB33N10TM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
FQB33N10TM Fairchild Semiconductor Corporation Check for Price Power Field-Effect Transistor, 33A I(D), 100V, 0.052ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3 FQB33N10TM vs FQB33N10TM

FQB33N10TM Related Parts

FQB33N10TM Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the FQB33N10TM is -55°C to 150°C.

  • To ensure proper biasing, follow the recommended biasing circuit and voltage levels outlined in the datasheet, and ensure the device is operated within the recommended operating conditions.

  • For optimal thermal performance, use a multi-layer PCB with a thermal pad connected to a heat sink or a thermal interface material. Ensure good thermal conductivity and minimal thermal resistance between the device and the heat sink.

  • Follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensure the device is stored in an ESD-protected environment. Use ESD-protected packaging and handling equipment to prevent damage during transportation and storage.

  • Use a soldering iron with a temperature range of 250°C to 260°C, and ensure the soldering time is within 3-5 seconds. Use a solder with a melting point above 217°C, and follow the recommended assembly and soldering guidelines outlined in the datasheet.

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