Part Details for FJV3114RMTF by onsemi
Results Overview of FJV3114RMTF by onsemi
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
FJV3114RMTF Information
FJV3114RMTF by onsemi is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for FJV3114RMTF
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
FJV3114RMTF
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Avnet Americas | Trans Digital BJT NPN 50V 100mA 3-Pin SOT-23 T/R - Tape and Reel (Alt: FJV3114RMTF) RoHS: Compliant Min Qty: 23810 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 477920 Partner Stock |
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$0.0282 / $0.0288 | Buy Now |
DISTI #
85987518
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Verical | Trans Digital BJT NPN 50V 0.1A 200mW 3-Pin SOT-23 T/R RoHS: Compliant Min Qty: 7557 Package Multiple: 1 Date Code: 1901 | Americas - 96000 |
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$0.0496 | Buy Now |
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Bristol Electronics | Min Qty: 34 | 1125 |
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$0.0450 / $0.1500 | Buy Now |
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Quest Components | SMALL SIGNAL BIPOLAR TRANSISTOR, 0.1A I(C), 50V V(BR)CEO, 1-ELEMENT, NPN, SILICON | 900 |
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$0.0400 / $0.2000 | Buy Now |
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Rochester Electronics | Small Signal Bipolar Transistor, 0.1A, 50V, NPN RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 96000 |
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$0.0246 / $0.0397 | Buy Now |
DISTI #
FJV3114RMTF
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Avnet Silica | Trans Digital BJT NPN 50V 100mA 3Pin SOT23 TR (Alt: FJV3114RMTF) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
FJV3114RMTF
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EBV Elektronik | Trans Digital BJT NPN 50V 100mA 3Pin SOT23 TR (Alt: FJV3114RMTF) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 477920 |
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RFQ |
Part Details for FJV3114RMTF
FJV3114RMTF CAD Models
FJV3114RMTF Part Data Attributes
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FJV3114RMTF
onsemi
Buy Now
Datasheet
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Compare Parts:
FJV3114RMTF
onsemi
NPN Epitaxial Silicon Transistor with Bias Resistor, SOT-23-3, 3000-REEL
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | SOT-23-3 | |
Package Description | SOT-23, 3 PIN | |
Manufacturer Package Code | 318BM | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Factory Lead Time | 2 Days | |
Samacsys Manufacturer | onsemi | |
Additional Feature | BUILT IN BIAS RESISTOR RATIO IS 10 | |
Collector Current-Max (IC) | 0.1 A | |
Collector-Emitter Voltage-Max | 50 V | |
Configuration | SINGLE WITH BUILT-IN RESISTOR | |
DC Current Gain-Min (hFE) | 68 | |
JESD-30 Code | R-PDSO-G3 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 3 | |
Operating Temperature-Max | 150 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity/Channel Type | NPN | |
Power Dissipation-Max (Abs) | 0.2 W | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON | |
Transition Frequency-Nom (fT) | 250 MHz |
Alternate Parts for FJV3114RMTF
This table gives cross-reference parts and alternative options found for FJV3114RMTF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of FJV3114RMTF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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FJV3114RMTF | Rochester Electronics LLC | Check for Price | 100mA, 50V, NPN, Si, SMALL SIGNAL TRANSISTOR, SOT-23, 3 PIN | FJV3114RMTF vs FJV3114RMTF |
FJV3114RMTF Frequently Asked Questions (FAQ)
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A recommended PCB layout for optimal thermal performance would be to have a solid copper plane on the bottom layer, connected to the thermal pad of the FJV3114RMTF, and to use thermal vias to dissipate heat. Additionally, keeping the PCB layer stack-up symmetrical and using a thermal interface material (TIM) between the device and the heat sink can also improve thermal performance.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Proper thermal design, including a suitable heat sink and thermal interface material, is crucial. Additionally, consider derating the device's power dissipation and voltage ratings at higher temperatures to prevent overheating and ensure reliable operation.
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The FJV3114RMTF has built-in ESD protection, but it's still essential to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap or mat, handle the device by the body or pins, and avoid touching the pins or die. Store the device in an anti-static bag or container, and follow the recommended soldering and assembly procedures to prevent ESD damage.
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The FJV3114RMTF is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use it in such an environment, consider applying a conformal coating to protect the device from moisture. Additionally, ensure the PCB is designed with moisture-resistant materials and follow proper assembly and soldering procedures to minimize the risk of moisture ingress.
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Follow the recommended soldering and assembly procedures outlined in the onsemi application note AN10426. Use a soldering iron with a temperature of 260°C to 280°C, and ensure the soldering time is within 3 seconds to 5 seconds. Use a solder with a melting point above 217°C, and avoid using solder with a high silver content. Additionally, follow proper PCB cleaning and drying procedures to prevent contamination and ensure reliable operation.