Datasheets
FF200R12KE3 by:

Insulated Gate Bipolar Transistor, 295A I(C), 1200V V(BR)CES, N-Channel, MODULE-7

Part Details for FF200R12KE3 by Infineon Technologies AG

Results Overview of FF200R12KE3 by Infineon Technologies AG

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FF200R12KE3 Information

FF200R12KE3 by Infineon Technologies AG is an IGBT.
IGBTs are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for FF200R12KE3

Part # Distributor Description Stock Price Buy
DISTI # 641-FF200R12KE3
Mouser Electronics IGBT Modules 1200V 200A DUAL RoHS: Compliant 36
  • 1 $117.8600
  • 10 $100.5500
$100.5500 / $117.8600 Buy Now
DISTI # FF200R12KE3
TME Module: IGBT, transistor/transistor, IGBT half-bridge, Ic: 200A Min Qty: 1 0
  • 1 $252.3700
  • 3 $217.4900
  • 10 $175.4300
$175.4300 / $252.3700 RFQ

Part Details for FF200R12KE3

FF200R12KE3 Part Data Attributes

FF200R12KE3 Infineon Technologies AG
Buy Now Datasheet
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FF200R12KE3 Infineon Technologies AG Insulated Gate Bipolar Transistor, 295A I(C), 1200V V(BR)CES, N-Channel, MODULE-7
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code MODULE
Package Description MODULE-7
Pin Count 7
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.29.00.95
Samacsys Manufacturer Infineon
Case Connection ISOLATED
Collector Current-Max (IC) 295 A
Collector-Emitter Voltage-Max 1200 V
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
Gate-Emitter Voltage-Max 20 V
JESD-30 Code R-XUFM-X7
Number of Elements 2
Number of Terminals 7
Operating Temperature-Max 150 °C
Package Body Material UNSPECIFIED
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 1040 W
Qualification Status Not Qualified
Surface Mount NO
Terminal Form UNSPECIFIED
Terminal Position UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Element Material SILICON
Turn-off Time-Nom (toff) 830 ns
Turn-on Time-Nom (ton) 400 ns
VCEsat-Max 2.15 V

FF200R12KE3 Related Parts

FF200R12KE3 Frequently Asked Questions (FAQ)

  • The maximum operating temperature of the FF200R12KE3 is 150°C, as specified in the datasheet. However, it's recommended to operate the module at a temperature below 125°C for optimal performance and reliability.

  • To ensure proper thermal management, it's essential to provide a good thermal interface between the module and the heat sink. Apply a thin layer of thermal interface material (TIM) to the base plate of the module, and ensure the heat sink is properly mounted and secured. Additionally, ensure good airflow around the heat sink to dissipate heat efficiently.

  • The recommended gate resistor value for the FF200R12KE3 is between 10 ohms and 20 ohms. However, the optimal value may vary depending on the specific application and switching frequency. It's recommended to consult the datasheet and application notes for more information.

  • Yes, the FF200R12KE3 can be used in a parallel configuration to increase the current handling capability. However, it's essential to ensure that the modules are properly matched and that the gate drive signals are synchronized to prevent uneven current sharing. Consult the datasheet and application notes for more information on parallel operation.

  • The maximum allowable voltage transient for the FF200R12KE3 is 1200 V, as specified in the datasheet. However, it's recommended to limit the voltage transient to 1000 V or less to ensure reliable operation and prevent damage to the module.

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