Part Details for FDMS0300S by Fairchild Semiconductor Corporation
Results Overview of FDMS0300S by Fairchild Semiconductor Corporation
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FDMS0300S Information
FDMS0300S by Fairchild Semiconductor Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for FDMS0300S
FDMS0300S CAD Models
FDMS0300S Part Data Attributes
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FDMS0300S
Fairchild Semiconductor Corporation
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Datasheet
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FDMS0300S
Fairchild Semiconductor Corporation
Power Field-Effect Transistor, 31A I(D), 30V, 0.0018ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MO-240AA, ROHS COMPLIANT, POWER 56, 8 PIN
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
Part Package Code | QFN | |
Package Description | ROHS COMPLIANT, POWER 56, 8 PIN | |
Pin Count | 8 | |
Manufacturer Package Code | 8LD,PQFN,JEDEC MO-240 AA,5.0X6.0MM | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.29.00.95 | |
Avalanche Energy Rating (Eas) | 242 mJ | |
Case Connection | DRAIN | |
Configuration | SINGLE WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 30 V | |
Drain Current-Max (ID) | 31 A | |
Drain-source On Resistance-Max | 0.0018 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
JEDEC-95 Code | MO-240AA | |
JESD-30 Code | R-PDSO-F5 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 5 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity/Channel Type | N-CHANNEL | |
Power Dissipation-Max (Abs) | 96 W | |
Pulsed Drain Current-Max (IDM) | 180 A | |
Surface Mount | YES | |
Terminal Form | FLAT | |
Terminal Position | DUAL | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON |
FDMS0300S Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
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To ensure reliable operation in high-temperature environments, follow the recommended operating temperature range, use a heat sink if necessary, and ensure good airflow around the device. Also, consider derating the device's power handling capabilities at higher temperatures.
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The high current rating of the FDMS0300S requires careful PCB design to ensure that the traces and vias can handle the high current density. Use wide traces, multiple vias, and a solid copper plane to minimize resistance and inductance.
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Use a combination of overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the device. OVP can be achieved using zener diodes or transient voltage suppressors, while OCP can be implemented using fuses, PTC thermistors, or current-sensing resistors.
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The FDMS0300S has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, grounding straps, and ionizers to minimize the risk of ESD damage.