Datasheets
FDMD8240LET40 by:

Dual N-Channel Power Trench® MOSFET 40V, 103A, 2.6mΩ, PQFN-12, 3000-REEL

Part Details for FDMD8240LET40 by onsemi

Results Overview of FDMD8240LET40 by onsemi

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Applications Energy and Power Systems Renewable Energy Automotive

FDMD8240LET40 Information

FDMD8240LET40 by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for FDMD8240LET40

Part # Distributor Description Stock Price Buy
DISTI # 01AC8551
Newark Fet 40V 2.6 Mohm Pqfn/Reel Rohs Compliant: Yes |Onsemi FDMD8240LET40 RoHS: Compliant Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Bulk 0
Buy Now
DISTI # FDMD8240LET40
Avnet Americas - Tape and Reel (Alt: FDMD8240LET40) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 111 Weeks, 0 Days Container: Reel 0
RFQ
DISTI # V79:2366_30170732
Arrow Electronics FDMD8240LET40 ON Semiconductor Transistors MOSFETs N-CH 40V 24A 12-Pin PQFN EP T/R - Arrow.com Min Qty: 1 Package Multiple: 1 Date Code: 2235 Americas - 3000
  • 1 $1.3550
$1.3550 Buy Now
DISTI # 87024274
Verical FDMD8240LET40 ON Semiconductor Transistors MOSFETs N-CH 40V 24A 12-Pin PQFN EP T/R - Arrow.com Min Qty: 5 Package Multiple: 1 Date Code: 2235 Americas - 3000
  • 5 $1.3550
$1.3550 Buy Now
DISTI # 85986522
Verical FDMD8240LET40 ON Semiconductor Transistors MOSFETs N-CH 40V 24A 12-Pin PQFN EP T/R - Arrow.com Min Qty: 202 Package Multiple: 1 Date Code: 2201 Americas - 1329
  • 202 $1.8625
  • 500 $1.6750
  • 1,000 $1.5500
  • 10,000 $1.3750
  • 100,000 $1.1566
$1.1566 / $1.8625 Buy Now
Rochester Electronics FDMD8240LET40 - Dual N-Channel Power Trench MOSFET 40V, 103A, 2.6m RoHS: Not Compliant Status: End of Life / Last Time Buy Min Qty: 1 1329
  • 100 $1.4900
  • 500 $1.3400
  • 1,000 $1.2400
  • 10,000 $1.1000
  • 100,000 $0.9253
$0.9253 / $1.4900 Buy Now
DISTI # FDMD8240LET40
TME Transistor: N-MOSFET x2, unipolar, 40V, 73A, Idm: 489A, 50W, PQFN12 Min Qty: 1 0
  • 1 $3.3100
  • 5 $2.9900
  • 25 $2.6400
  • 100 $2.3700
  • 500 $2.2200
$2.2200 / $3.3100 RFQ
DISTI # FDMD8240LET40
Richardson RFPD POWER MOSFET TRANSISTOR RoHS: Compliant Min Qty: 1 0
RFQ

Part Details for FDMD8240LET40

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FDMD8240LET40 Part Data Attributes

FDMD8240LET40 onsemi
Buy Now Datasheet
Compare Parts:
FDMD8240LET40 onsemi Dual N-Channel Power Trench® MOSFET 40V, 103A, 2.6mΩ, PQFN-12, 3000-REEL
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ONSEMI
Part Package Code PQFN-12
Manufacturer Package Code 483BN
Reach Compliance Code not_compliant
ECCN Code EAR99
Factory Lead Time 111 Weeks
Samacsys Manufacturer onsemi
Avalanche Energy Rating (Eas) 216 mJ
Case Connection DRAIN SOURCE
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 40 V
Drain Current-Max (ID) 103 A
Drain-source On Resistance-Max 0.0026 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 52 pF
JESD-30 Code R-PDSO-N12
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 2
Number of Terminals 12
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 50 W
Pulsed Drain Current-Max (IDM) 489 A
Surface Mount YES
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form NO LEAD
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
Transistor Element Material SILICON
Turn-off Time-Max (toff) 76 ns
Turn-on Time-Max (ton) 38 ns

FDMD8240LET40 Related Parts

FDMD8240LET40 Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. Use thermal interface material (TIM) and a heat sink if possible.

  • Use a shielded enclosure, keep sensitive analog circuits away from the FDMD8240LET40, and ensure proper grounding and decoupling. Implement EMI filters and shielding on cables and connectors.

  • Ensure a stable clock signal with minimal jitter (<100ps). Synchronize the device with other components using a single clock domain. Use a clock buffer or repeater if necessary.

  • Use a low-ESR capacitor (e.g., 10uF) close to the device's power pins. Add a 1uF decoupling capacitor between the power pins and a 10nF capacitor between the power pins and ground. Ensure a clean, low-noise power supply.

  • Perform functional testing, including input/output signal integrity and power consumption verification. Use a logic analyzer or oscilloscope to verify signal timing and integrity. Validate the device's performance under various operating conditions.

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