Part Details for FDMC86160 by Fairchild Semiconductor Corporation
Results Overview of FDMC86160 by Fairchild Semiconductor Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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FDMC86160 Information
FDMC86160 by Fairchild Semiconductor Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for FDMC86160
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Transistors | 13013 |
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RFQ |
Part Details for FDMC86160
FDMC86160 CAD Models
FDMC86160 Part Data Attributes
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FDMC86160
Fairchild Semiconductor Corporation
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Datasheet
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FDMC86160
Fairchild Semiconductor Corporation
Power Field-Effect Transistor, 9A I(D), 100V, 0.014ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MO-240BA, ROHS COMPLIANT, POWER 33, 8 PIN
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | QFN | |
| Package Description | ROHS COMPLIANT, POWER 33, 8 PIN | |
| Pin Count | 8 | |
| Manufacturer Package Code | 8LD, PQFN, POWERCLIP SINGLE, JEDEC, MO-240, 3.3X3.3 MM | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.95 | |
| Avalanche Energy Rating (Eas) | 181 mJ | |
| Case Connection | DRAIN | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 100 V | |
| Drain Current-Max (ID) | 9 A | |
| Drain-source On Resistance-Max | 0.014 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JEDEC-95 Code | MO-240BA | |
| JESD-30 Code | S-PDSO-N5 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 5 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 54 W | |
| Pulsed Drain Current-Max (IDM) | 50 A | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
FDMC86160 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The PCB should also have a solid ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure good thermal design, use a heat sink if necessary, and avoid overheating the device.
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To minimize EMI and RFI, use a shielded layout, keep the device away from noise sources, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Also, ensure good decoupling and bypassing of the power supply lines.
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When selecting an input capacitor, consider the voltage rating, capacitance value, and ESR (Equivalent Series Resistance). A low-ESR capacitor with a voltage rating higher than the maximum input voltage is recommended. A 10uF to 22uF capacitor is a good starting point.
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Monitor the input voltage, output voltage, output current, and junction temperature (Tj) to ensure reliable operation. Also, monitor the device's power dissipation and thermal resistance to prevent overheating.