Part Details for FDMC8032L by Fairchild Semiconductor Corporation
Results Overview of FDMC8032L by Fairchild Semiconductor Corporation
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FDMC8032L Information
FDMC8032L by Fairchild Semiconductor Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for FDMC8032L
FDMC8032L CAD Models
FDMC8032L Part Data Attributes
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FDMC8032L
Fairchild Semiconductor Corporation
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Datasheet
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FDMC8032L
Fairchild Semiconductor Corporation
Power Field-Effect Transistor, 7A I(D), 40V, 0.02ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MO-229, 3 X 3 MM, ROHS COMPLIANT, POWER 33, MLP, 8 PIN
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | MLP | |
| Package Description | 3 X 3 MM, ROHS COMPLIANT, POWER 33, MLP, 8 PIN | |
| Pin Count | 8 | |
| Manufacturer Package Code | 8LD, MLP, DUAL, NON-JEDEC, 3 X 3MM | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.95 | |
| Avalanche Energy Rating (Eas) | 13 mJ | |
| Case Connection | DRAIN | |
| Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 40 V | |
| Drain Current-Max (ID) | 7 A | |
| Drain-source On Resistance-Max | 0.02 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JEDEC-95 Code | MO-229 | |
| JESD-30 Code | S-PDSO-N4 | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 2 | |
| Number of Terminals | 4 | |
| Operating Mode | ENHANCEMENT MODE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | N-CHANNEL | |
| Pulsed Drain Current-Max (IDM) | 50 A | |
| Surface Mount | YES | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | NO LEAD | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
FDMC8032L Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The PCB should also have a solid ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, use a heat sink if necessary, and ensure that the device is operated within its specified temperature range.
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To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are properly grounded. Avoid touching the device's pins or leads, and use an anti-static wrist strap or mat when handling the device.
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To troubleshoot issues with the device's output voltage regulation, check the input voltage, output voltage, and output current. Verify that the device is properly configured and that the output capacitor is of sufficient value. Also, check for any signs of overheating or excessive current draw.
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When selecting the output capacitor, consider the capacitor's value, type, and ESR (Equivalent Series Resistance). A capacitor with a low ESR and a value between 10uF to 22uF is recommended. The capacitor should also be rated for the output voltage and operating temperature range.