Part Details for FDMC4435BZ by Fairchild Semiconductor Corporation
Results Overview of FDMC4435BZ by Fairchild Semiconductor Corporation
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
FDMC4435BZ Information
FDMC4435BZ by Fairchild Semiconductor Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for FDMC4435BZ
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 2000 |
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RFQ | ||
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Quest Components | 1600 |
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$0.5250 / $1.5000 | Buy Now | |
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Vyrian | Transistors | 66203 |
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RFQ | |
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Win Source Electronics | MOSFET P-CH 30V 8.5A POWER33 | 145000 |
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$0.6985 / $0.9023 | Buy Now |
Part Details for FDMC4435BZ
FDMC4435BZ CAD Models
FDMC4435BZ Part Data Attributes
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FDMC4435BZ
Fairchild Semiconductor Corporation
Buy Now
Datasheet
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FDMC4435BZ
Fairchild Semiconductor Corporation
Power Field-Effect Transistor, 8.5A I(D), 30V, 0.02ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, 3.30 X 3.30 MM, ROHS COMPLIANT, MLP, 8 PIN
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | MLP | |
| Package Description | 3.30 X 3.30 MM, ROHS COMPLIANT, MLP, 8 PIN | |
| Pin Count | 8 | |
| Manufacturer Package Code | 8LD,MLP,DUAL, 3.3MM SQUARE | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.95 | |
| Additional Feature | ULTRA-LOW RESISTANCE | |
| Avalanche Energy Rating (Eas) | 24 mJ | |
| Case Connection | DRAIN | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 30 V | |
| Drain Current-Max (ID) | 8.5 A | |
| Drain-source On Resistance-Max | 0.02 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | S-PDSO-N5 | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 5 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | P-CHANNEL | |
| Power Dissipation-Max (Abs) | 31 W | |
| Pulsed Drain Current-Max (IDM) | 50 A | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | NO LEAD | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
FDMC4435BZ Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
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The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to provide a stable input voltage and bias the device correctly.
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Critical components to consider when designing a power supply with FDMC4435BZ include the input capacitor, output capacitor, inductor, and diode. These components affect the power supply's efficiency, stability, and output voltage ripple.
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Overvoltage and undervoltage protection can be achieved using a voltage supervisor or a voltage monitor IC. These devices can detect abnormal voltage conditions and shut down the power supply to protect the FDMC4435BZ and other components.
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Thermal design considerations for the FDMC4435BZ include providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. The device's thermal pad should be connected to a heat sink or a thermal pad on the PCB.