Part Details for FDD3670 by Fairchild Semiconductor Corporation
Results Overview of FDD3670 by Fairchild Semiconductor Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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FDD3670 Information
FDD3670 by Fairchild Semiconductor Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for FDD3670
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 998 |
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RFQ | ||
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Bristol Electronics | 63 |
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RFQ | ||
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Quest Components | 798 |
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$1.4220 / $3.7920 | Buy Now | |
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Quest Components | 50 |
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$1.7380 / $3.1600 | Buy Now | |
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Vyrian | Transistors | 2552 |
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RFQ |
Part Details for FDD3670
FDD3670 CAD Models
FDD3670 Part Data Attributes
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FDD3670
Fairchild Semiconductor Corporation
Buy Now
Datasheet
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FDD3670
Fairchild Semiconductor Corporation
Power Field-Effect Transistor, 34A I(D), 100V, 0.032ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252, DPAK-3
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
| Part Package Code | DPAK | |
| Package Description | DPAK-3 | |
| Pin Count | 3 | |
| Manufacturer Package Code | TO252 (D-PAK), MOLDED, 3 LEAD,OPTION AA&AB | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.95 | |
| Avalanche Energy Rating (Eas) | 360 mJ | |
| Case Connection | DRAIN | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 100 V | |
| Drain Current-Max (ID) | 34 A | |
| Drain-source On Resistance-Max | 0.032 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JEDEC-95 Code | TO-252 | |
| JESD-30 Code | R-PSSO-G2 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 175 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 1.6 W | |
| Pulsed Drain Current-Max (IDM) | 100 A | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | SINGLE | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
FDD3670 Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the FDD3670 is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance.
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To ensure proper biasing, make sure to follow the recommended voltage and current ratings in the datasheet. Typically, a voltage supply of 12V to 15V is recommended, and the current limit should be set to 1A to 2A, depending on the application.
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For optimal thermal management, it's recommended to use a multi-layer PCB with a thermal pad connected to a heat sink or a copper plane. Keep the component away from high-temperature sources and ensure good airflow around the device. A minimum of 1 oz copper thickness is recommended for the PCB.
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Yes, the FDD3670 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency is within the device's capabilities.
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To protect the FDD3670 from ESD, follow proper handling and storage procedures. Use an ESD wrist strap or mat when handling the device, and store it in an anti-static bag or container. Ensure that the PCB and assembly process also follow ESD protection guidelines.