Part Details for ES1F by Diotec Semiconductor AG
Results Overview of ES1F by Diotec Semiconductor AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ES1F Information
ES1F by Diotec Semiconductor AG is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for ES1F
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
4878-ES1FCT-ND
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DigiKey | DIODE STANDARD 300V 1A DO214AC Min Qty: 1 Lead time: 8 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
7385 In Stock |
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$0.0641 / $0.4500 | Buy Now |
DISTI #
637-ES1F
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Mouser Electronics | Rectifiers Diode, Superfast, SMA, 300V, 1A, 150C RoHS: Compliant | 7608 |
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$0.0610 / $0.4500 | Buy Now |
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Onlinecomponents.com | Diode - Superfast - SMA - 300V - 1A - 25ns RoHS: Compliant | 0 |
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$0.0548 / $0.0645 | Buy Now |
DISTI #
78442269
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Verical | Diode Switching 300V 1A 2-Pin SMA T/R Min Qty: 618 Package Multiple: 1 | Americas - 5139 |
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$0.0833 / $0.1016 | Buy Now |
DISTI #
ES1F-DIO
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TME | Diode: rectifying, SMD, 300V, 1A, 25ns, SMA, Ufmax: 1.3V, Ifsm: 30A Min Qty: 10 | 6300 |
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$0.0610 / $0.1010 | Buy Now |
Part Details for ES1F
ES1F CAD Models
ES1F Part Data Attributes
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ES1F
Diotec Semiconductor AG
Buy Now
Datasheet
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ES1F
Diotec Semiconductor AG
Rectifier Diode, Blank, 1 Element, 1A, 300V V(RRM), Silicon, DO-214AC, SMA, 2 PIN
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | DIOTEC SEMICONDUCTOR AG | |
Part Package Code | DO-214AC | |
Package Description | SMA, 2 PIN | |
Pin Count | 2 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Samacsys Manufacturer | Diotec | |
Application | GENERAL PURPOSE | |
Configuration | SINGLE | |
Diode Element Material | SILICON | |
Diode Type | RECTIFIER DIODE | |
Forward Voltage-Max (VF) | 1.3 V | |
JEDEC-95 Code | DO-214AC | |
JESD-30 Code | R-PDSO-C2 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Non-rep Pk Forward Current-Max | 33 A | |
Number of Elements | 1 | |
Number of Phases | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -50 °C | |
Output Current-Max | 1 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Rep Pk Reverse Voltage-Max | 300 V | |
Reverse Recovery Time-Max | 0.025 µs | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | C BEND | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
ES1F Frequently Asked Questions (FAQ)
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A recommended PCB layout for optimal thermal performance of ES1F includes a large copper area on the top and bottom layers, connected to the tab of the device, and a thermal via array underneath the device to dissipate heat efficiently.
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To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves, ensure good thermal design, and consider using a heat sink or thermal interface material to reduce the junction temperature.
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ES1F has an integrated ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and storage. Additionally, consider adding external ESD protection devices if the application requires it.
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Yes, ES1F can be used in switching regulator applications, but it's essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range.
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The package type selection depends on the application's thermal requirements, PCB layout, and assembly process. The TO-220 package is suitable for most applications, but the TO-263 package may be preferred for higher power density designs.