Part Details for EPM3064ATC100-7N by Intel Corporation
Results Overview of EPM3064ATC100-7N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
EPM3064ATC100-7N Information
EPM3064ATC100-7N by Intel Corporation is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for EPM3064ATC100-7N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Cytech Systems Limited | IC CPLD 64MC 7.5NS 100TQFP | 500 |
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RFQ |
Part Details for EPM3064ATC100-7N
EPM3064ATC100-7N CAD Models
EPM3064ATC100-7N Part Data Attributes
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EPM3064ATC100-7N
Intel Corporation
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Datasheet
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EPM3064ATC100-7N
Intel Corporation
EE PLD, 7.5ns, 64-Cell, CMOS, PQFP100, TQFP-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | TQFP-100 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| Additional Feature | YES | |
| Clock Frequency-Max | 135.1 MHz | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | |
| JTAG BST | YES | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | ||
| Number of I/O Lines | 66 | |
| Number of Inputs | 66 | |
| Number of Macro Cells | 64 | |
| Number of Outputs | 62 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 0 DEDICATED INPUTS, 62 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Programmable Logic Type | EE PLD | |
| Propagation Delay | 7.5 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.27 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Matte Tin (Sn) - annealed | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm |
Alternate Parts for EPM3064ATC100-7N
This table gives cross-reference parts and alternative options found for EPM3064ATC100-7N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPM3064ATC100-7N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| EPM3064ATC100-7 | Altera Corporation | $4.3962 | EE PLD, 7.5ns, 64-Cell, CMOS, PQFP100, TQFP-100 | EPM3064ATC100-7N vs EPM3064ATC100-7 |
| EPM3064ATC100-7N | Altera Corporation | Check for Price | EE PLD, 7.5ns, 64-Cell, CMOS, PQFP100, TQFP-100 | EPM3064ATC100-7N vs EPM3064ATC100-7N |
| EPM3064ATC100-7 | Intel Corporation | Check for Price | EE PLD, 7.5ns, 64-Cell, CMOS, PQFP100, TQFP-100 | EPM3064ATC100-7N vs EPM3064ATC100-7 |
EPM3064ATC100-7N Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and minimizing the distance between the device and the heat sink. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
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To ensure reliable programming and configuration of the FPGA, use a reliable programming cable, ensure the power supply is stable, and follow the recommended programming procedure outlined in the datasheet. Additionally, use a checksum or CRC to verify the integrity of the configuration data.
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For signal integrity and routing of high-speed signals, consider using differential pairs, minimizing trace length and impedance discontinuities, and using signal shielding and termination. Also, follow the recommended routing guidelines outlined in the datasheet and use simulation tools to verify signal integrity.
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To handle power sequencing and power-on reset for the FPGA, use a power sequencer or a power management IC to ensure that the power supplies are turned on in the correct order. Also, use a power-on reset circuit to ensure that the FPGA is properly reset during power-up.
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To minimize EMI and ensure EMC, use a metal enclosure, shielded cables, and follow good PCB layout practices such as separating analog and digital circuits. Also, use EMI filters and shielding on I/O lines, and ensure that the FPGA is properly decoupled.