Part Details for EPM2210F324I5N by Intel Corporation
Results Overview of EPM2210F324I5N by Intel Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Telecommunications
EPM2210F324I5N Information
EPM2210F324I5N by Intel Corporation is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for EPM2210F324I5N
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | FLASH PLD, PBGA324 | 200 |
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$122.9967 / $163.9956 | Buy Now |
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Cytech Systems Limited | IC CPLD 1700MC 7NS 324FBGA | 84 |
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RFQ |
Part Details for EPM2210F324I5N
EPM2210F324I5N CAD Models
EPM2210F324I5N Part Data Attributes
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EPM2210F324I5N
Intel Corporation
Buy Now
Datasheet
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Compare Parts:
EPM2210F324I5N
Intel Corporation
Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| Additional Feature | IT CAN ALSO OPERATE AT 3.3V | |
| Clock Frequency-Max | 172.4 MHz | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| JTAG BST | YES | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | ||
| Number of I/O Lines | 272 | |
| Number of Inputs | 272 | |
| Number of Macro Cells | 1700 | |
| Number of Outputs | 272 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 0 DEDICATED INPUTS, 272 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FLASH PLD | |
| Propagation Delay | 11.2 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.2 mm | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm |
Alternate Parts for EPM2210F324I5N
This table gives cross-reference parts and alternative options found for EPM2210F324I5N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPM2210F324I5N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| EPM2210F324I5N | Altera Corporation | $63.2500 | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 | EPM2210F324I5N vs EPM2210F324I5N |
| EPM2210F324I5 | Altera Corporation | $69.5701 | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, FBGA-324 | EPM2210F324I5N vs EPM2210F324I5 |
| EPM2210F324C5 | Intel Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, FBGA-324 | EPM2210F324I5N vs EPM2210F324C5 |
| EPM2210F324A5 | Intel Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, | EPM2210F324I5N vs EPM2210F324A5 |
| EPM2210F324C5N | Intel Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 | EPM2210F324I5N vs EPM2210F324C5N |
| EPM2210F324A5 | Altera Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324 | EPM2210F324I5N vs EPM2210F324A5 |
| EPM2210F324C5 | Altera Corporation | Check for Price | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, FBGA-324 | EPM2210F324I5N vs EPM2210F324C5 |
EPM2210F324I5N Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
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Use the Intel Quartus Prime software to program and configure the FPGA. Ensure that the device is properly powered and clocked before programming, and follow the recommended programming and configuration procedures outlined in the Quartus Prime documentation.
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The power supplies should be sequenced in the following order: VCCIO, VCC, and VCCA. The power supplies should be ramped up slowly to prevent damage to the device. Refer to the datasheet for specific power sequencing requirements.
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Handle the device by the body or the pins, avoiding touching the die. Store the device in an anti-static bag or wrap it in anti-static material to prevent electrostatic discharge (ESD) damage.
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The device has a maximum junction temperature of 100°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid blocking the airflow around the device.