Part Details for EPC2016C by Efficient Power Conversion
Results Overview of EPC2016C by Efficient Power Conversion
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Environmental Monitoring
Industrial Automation
EPC2016C Information
EPC2016C by Efficient Power Conversion is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for EPC2016C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
917-1080-1-ND
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DigiKey | GANFET N-CH 100V 18A DIE Min Qty: 1 Lead time: 16 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
67837 In Stock |
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$1.0875 / $3.4000 | Buy Now |
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Vyrian | Transistors | 101905 |
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RFQ |
Part Details for EPC2016C
EPC2016C CAD Models
EPC2016C Part Data Attributes
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EPC2016C
Efficient Power Conversion
Buy Now
Datasheet
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Compare Parts:
EPC2016C
Efficient Power Conversion
Power Field-Effect Transistor, 18A I(D), 100V, 0.016ohm, 1-Element, N-Channel, Gallium Nitride, Metal-oxide Semiconductor FET, HALOGEN FREE AND ROHS COMPLIANT, DIE-6
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| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | EFFICIENT POWER CONVERSION CORP | |
| Package Description | HALOGEN FREE AND ROHS COMPLIANT, DIE-6 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Additional Feature | ULTRA LOW RESISTANCE | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 100 V | |
| Drain Current-Max (ID) | 18 A | |
| Drain-source On Resistance-Max | 0.016 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-XXUC-X6 | |
| Number of Elements | 1 | |
| Number of Terminals | 6 | |
| Operating Mode | ENHANCEMENT MODE | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Polarity/Channel Type | N-CHANNEL | |
| Pulsed Drain Current-Max (IDM) | 75 A | |
| Surface Mount | YES | |
| Terminal Form | UNSPECIFIED | |
| Terminal Position | UNSPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | GALLIUM NITRIDE |
Alternate Parts for EPC2016C
This table gives cross-reference parts and alternative options found for EPC2016C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPC2016C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| CSD19534Q5AT | Texas Instruments | $1.9946 | 100-V, N channel NexFET™ power MOSFET, single SON 5 mm x 6 mm, 15.1 mOhm 8-VSONP -55 to 150 | EPC2016C vs CSD19534Q5AT |
| BSC159N10LSFG | Infineon Technologies AG | Check for Price | Power Field-Effect Transistor, 9.4A I(D), 100V, 0.0159ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, TDSON-8 | EPC2016C vs BSC159N10LSFG |
EPC2016C Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the EPC2016C is -55°C to 150°C.
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To ensure proper biasing, follow the recommended biasing circuit and voltage levels outlined in the datasheet, and ensure the device is operated within the recommended voltage and current ranges.
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For optimal thermal performance, use a multi-layer PCB with a solid ground plane, and ensure good thermal conductivity between the device and the PCB. Follow the recommended land pattern and thermal pad layout in the datasheet.
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Handle the EPC2016C with ESD-protective equipment and follow proper ESD handling procedures to prevent damage. Use an ESD wrist strap or mat, and ensure the workspace is ESD-protected.
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Follow the recommended soldering and rework conditions outlined in the datasheet, including temperature profiles and dwell times, to ensure reliable assembly and minimize the risk of damage.