Datasheets
EPC1213PC8 by:

Configuration Memory, 212942X1, Serial, MOS, PDIP8, PLASTIC, DIP-8

Part Details for EPC1213PC8 by Intel Corporation

Results Overview of EPC1213PC8 by Intel Corporation

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EPC1213PC8 Information

EPC1213PC8 by Intel Corporation is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for EPC1213PC8

Part # Distributor Description Stock Price Buy
Win Source Electronics IC CONFIG DEVICE 1MBIT 8DIP 247
  • 3 $25.0254
  • 6 $20.5336
  • 9 $19.8926
  • 12 $19.2504
  • 16 $18.6094
  • 21 $16.6840
$16.6840 / $25.0254 Buy Now

Part Details for EPC1213PC8

EPC1213PC8 CAD Models

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EPC1213PC8 Part Data Attributes

EPC1213PC8 Intel Corporation
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EPC1213PC8 Intel Corporation Configuration Memory, 212942X1, Serial, MOS, PDIP8, PLASTIC, DIP-8
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Package Description DIP-8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 75 ns
Clock Frequency-Max (fCLK) 6 MHz
I/O Type COMMON
JESD-30 Code R-PDIP-T8
JESD-609 Code e0
Length 9.398 mm
Memory Density 212942 bit
Memory IC Type CONFIGURATION MEMORY
Memory Width 1
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 8
Number of Words 212942 words
Number of Words Code 212942
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 212942X1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial SERIAL
Qualification Status Not Qualified
Seated Height-Max 4.318 mm
Standby Current-Max 0.0002 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for EPC1213PC8

This table gives cross-reference parts and alternative options found for EPC1213PC8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPC1213PC8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
EPC1213PC8 Altera Corporation Check for Price Configuration Memory, 212942X1, Serial, MOS, PDIP8, PLASTIC, DIP-8 EPC1213PC8 vs EPC1213PC8
EPC1213PI8 Intel Corporation Check for Price Configuration Memory, 212942X1, Serial, MOS, PDIP8, PLASTIC, DIP-8 EPC1213PC8 vs EPC1213PI8
EPC1213PC Altera Corporation Check for Price Configuration Memory, 26KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 EPC1213PC8 vs EPC1213PC

EPC1213PC8 Related Parts

EPC1213PC8 Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power plane and use a low-ESR capacitor for decoupling.

  • Use a heat sink with a thermal resistance of less than 10°C/W and ensure good airflow around the device. Also, consider using a thermal interface material with a thermal conductivity of at least 1 W/m-K.

  • The maximum allowed voltage on the input pins is 3.6V. Exceeding this voltage may cause permanent damage to the device.

  • Use a logic analyzer or oscilloscope to capture the input and output signals. Check the power supply voltage, clock frequency, and input signal integrity. Consult the datasheet and application notes for troubleshooting guidelines.

  • No, the EPC1213PC8 is not designed for radiation-hardened applications. It does not meet the requirements for total ionizing dose (TID) or single-event effects (SEE).

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