Part Details for EP4SGX70HF35I3N by Intel Corporation
Results Overview of EP4SGX70HF35I3N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
EP4SGX70HF35I3N Information
EP4SGX70HF35I3N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for EP4SGX70HF35I3N
| Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018, Lead time:5-7days | 58 Stock,256 Available |
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$2,507.2700 / $3,185.4700 | Buy Now |
Part Details for EP4SGX70HF35I3N
EP4SGX70HF35I3N CAD Models
EP4SGX70HF35I3N Part Data Attributes
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EP4SGX70HF35I3N
Intel Corporation
Buy Now
Datasheet
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EP4SGX70HF35I3N
Intel Corporation
Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LEAD FREE, FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 717 MHz | |
| JESD-30 Code | S-PBGA-B1152 | |
| JESD-609 Code | e1 | |
| Length | 35 mm | |
| Number of CLBs | 29040 | |
| Number of Inputs | 488 | |
| Number of Logic Cells | 72600 | |
| Number of Outputs | 488 | |
| Number of Terminals | 1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 29040 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.6 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm |
Alternate Parts for EP4SGX70HF35I3N
This table gives cross-reference parts and alternative options found for EP4SGX70HF35I3N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP4SGX70HF35I3N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| EP4SGX70HF35C3N | Altera Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35C3N |
| EP4SGX70HF35I3N | Altera Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35I3N |
| EP4SGX70HF35C3 | Intel Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35C3 |
| EP4SGX70HF35C3 | Altera Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35C3 |
| EP4SGX70HF35C4N | Intel Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35C4N |
| EP4SGX70HF35C3N | Intel Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35C3N |
| EP4SGX70HF35I4 | Intel Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35I4 |
| EP4SGX70HF35I4N | Altera Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35I4N |
| EP4SGX70HF35I4N | Intel Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35I4N |
| EP4SGX70HF35C4N | Altera Corporation | Check for Price | Field Programmable Gate Array, 29040 CLBs, 717MHz, 72600-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP4SGX70HF35I3N vs EP4SGX70HF35C4N |
EP4SGX70HF35I3N Frequently Asked Questions (FAQ)
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The maximum power consumption of EP4SGX70HF35I3N is around 12W, but it can vary depending on the specific use case and operating conditions.
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To optimize the performance of EP4SGX70HF35I3N, you can use Intel's Quartus Prime software to optimize the design, reduce power consumption, and improve timing closure. Additionally, you can use Intel's PowerPlay power management technology to dynamically adjust power consumption based on the system's workload.
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The maximum operating temperature of EP4SGX70HF35I3N is 100°C (industrial temperature range). However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
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To ensure signal integrity in EP4SGX70HF35I3N-based designs, you can use Intel's signal integrity analysis tools, such as the Signal Integrity Center, to analyze and optimize signal transmission. Additionally, you can use techniques such as impedance matching, termination, and shielding to minimize signal degradation and noise.
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The recommended PCB layout and stackup for EP4SGX70HF35I3N involves using a high-speed PCB material, such as FR4 or Rogers, with a minimum of 4 layers (2 signal layers, 1 power layer, and 1 ground layer). The device should be placed in a central location on the board, with signal traces routed away from the device in a star configuration to minimize noise and crosstalk.