Part Details for EP4SGX230FF35I3N by Intel Corporation
Results Overview of EP4SGX230FF35I3N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
EP4SGX230FF35I3N Information
EP4SGX230FF35I3N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for EP4SGX230FF35I3N
Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018, Lead time:5-7days | 78 Stock,254 Available |
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$3,298.5300 / $4,190.7600 | Buy Now |
Part Details for EP4SGX230FF35I3N
EP4SGX230FF35I3N CAD Models
EP4SGX230FF35I3N Part Data Attributes
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EP4SGX230FF35I3N
Intel Corporation
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Datasheet
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EP4SGX230FF35I3N
Intel Corporation
Field Programmable Gate Array, 9120 CLBs, 717MHz, 228000-Cell, CMOS, PBGA1152, 35 X 35 MM, LEAD FREE, FBGA-1152
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 35 X 35 MM, LEAD FREE, FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Clock Frequency-Max | 717 MHz | |
JESD-30 Code | S-PBGA-B1152 | |
JESD-609 Code | e1 | |
Length | 35 mm | |
Number of CLBs | 9120 | |
Number of Inputs | 564 | |
Number of Logic Cells | 228000 | |
Number of Outputs | 564 | |
Number of Terminals | 1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 9120 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.6 mm | |
Supply Voltage-Max | 0.93 V | |
Supply Voltage-Min | 0.87 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm |
Alternate Parts for EP4SGX230FF35I3N
This table gives cross-reference parts and alternative options found for EP4SGX230FF35I3N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP4SGX230FF35I3N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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EP4SGX230FF35C3NES | Intel Corporation | Check for Price | Field Programmable Gate Array, 9120 CLBs, 717MHz, PBGA1152, 35 X 35 MM, LEAD FREE, FBGA-1152 | EP4SGX230FF35I3N vs EP4SGX230FF35C3NES |
EP4SGX230FF35I3G | Intel Corporation | Check for Price | Field Programmable Gate Array, 9120 CLBs, PBGA1152, FBGA-1152 | EP4SGX230FF35I3N vs EP4SGX230FF35I3G |
EP4SGX230FF35C3NES | Altera Corporation | Check for Price | Field Programmable Gate Array, 9120 CLBs, 717MHz, PBGA1152, 35 X 35 MM, LEAD FREE, FBGA-1152 | EP4SGX230FF35I3N vs EP4SGX230FF35C3NES |
EP4SGX230FF35M3N | Intel Corporation | Check for Price | Field Programmable Gate Array, | EP4SGX230FF35I3N vs EP4SGX230FF35M3N |
EP4SGX230FF35C3ES | Intel Corporation | Check for Price | Field Programmable Gate Array, 9120 CLBs, 717MHz, PBGA1152, 35 X 35 MM, FBGA-1152 | EP4SGX230FF35I3N vs EP4SGX230FF35C3ES |
EP4SGX230FF35C3N | Intel Corporation | Check for Price | Field Programmable Gate Array, 228000-Cell, CMOS, PBGA1152, | EP4SGX230FF35I3N vs EP4SGX230FF35C3N |
EP4SGX230FF35I3N Frequently Asked Questions (FAQ)
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Intel provides a PCB layout guide and thermal management guidelines in their documentation, which should be followed to ensure proper heat dissipation and signal integrity.
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Optimizing power consumption requires careful design and implementation of power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Intel provides power estimation and optimization tools to help with this process.
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Implementing reliable and fault-tolerant designs requires following best practices such as using triple modular redundancy, error correction codes, and built-in self-test (BIST) techniques. Intel provides guidelines and tools to help with this process.
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Ensuring signal integrity and minimizing EMI requires careful PCB layout, signal routing, and shielding. Intel provides guidelines and tools to help with signal integrity analysis and EMI mitigation.
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Using this FPGA in high-reliability or safety-critical applications requires careful consideration of factors such as radiation tolerance, single-event upset (SEU) mitigation, and fault tolerance. Intel provides documentation and support to help with these considerations.