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Field Programmable Gate Array, 3118 CLBs, 472.5MHz, 49888-Cell, PBGA484, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
EP4CGX50CF23C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
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EP4CGX50CF23C8N
Intel Corporation
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Datasheet
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EP4CGX50CF23C8N
Intel Corporation
Field Programmable Gate Array, 3118 CLBs, 472.5MHz, 49888-Cell, PBGA484, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Clock Frequency-Max | 472.5 MHz | |
JESD-30 Code | S-PBGA-B484 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 3118 | |
Number of Inputs | 290 | |
Number of Logic Cells | 49888 | |
Number of Outputs | 290 | |
Number of Terminals | 484 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 3118 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.4 mm | |
Supply Voltage-Max | 1.24 V | |
Supply Voltage-Min | 1.16 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm |
This table gives cross-reference parts and alternative options found for EP4CGX50CF23C8N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP4CGX50CF23C8N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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EP4CGX50CF23C8N | Altera Corporation | $129.2800 | Field Programmable Gate Array, 3118 CLBs, 472.5MHz, 49888-Cell, PBGA484, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 | EP4CGX50CF23C8N vs EP4CGX50CF23C8N |
The maximum power consumption of EP4CGX50CF23C8N is approximately 2.5W, but it can vary depending on the specific use case and operating conditions.
To optimize the performance of EP4CGX50CF23C8N, ensure that the device is properly cooled, use the optimal clock frequency, and optimize the design to minimize power consumption. Additionally, use the Intel Quartus II software to optimize the FPGA design for performance.
The maximum operating temperature of EP4CGX50CF23C8N is 100°C (industrial temperature range) and 85°C (commercial temperature range).
To ensure the reliability of EP4CGX50CF23C8N in harsh environments, follow proper design and manufacturing guidelines, use a robust PCB design, and ensure proper thermal management. Additionally, consider using conformal coating and other environmental protection measures.
EP4CGX50CF23C8N is a radiation-tolerant device, but it's not radiation-hardened. It's designed to withstand certain levels of radiation, but it's not suitable for high-radiation environments. Consult the datasheet and Intel's radiation effects documentation for more information.