Part Details for EP4CGX150DF31C8N by Intel Corporation
Results Overview of EP4CGX150DF31C8N by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Security and Surveillance
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
EP4CGX150DF31C8N Information
EP4CGX150DF31C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for EP4CGX150DF31C8N
EP4CGX150DF31C8N CAD Models
EP4CGX150DF31C8N Part Data Attributes
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EP4CGX150DF31C8N
Intel Corporation
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Datasheet
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EP4CGX150DF31C8N
Intel Corporation
Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA896, 31 X 31 MM, 1 MM PITCH, LEAD FREE, FBGA-896
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | 31 X 31 MM, 1 MM PITCH, LEAD FREE, FBGA-896 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel | |
| Clock Frequency-Max | 472.5 MHz | |
| JESD-30 Code | S-PBGA-B896 | |
| JESD-609 Code | e1 | |
| Length | 31 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 9360 | |
| Number of Inputs | 475 | |
| Number of Logic Cells | 149760 | |
| Number of Outputs | 475 | |
| Number of Terminals | 896 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 9360 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.4 mm | |
| Supply Voltage-Max | 1.24 V | |
| Supply Voltage-Min | 1.16 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm |
Alternate Parts for EP4CGX150DF31C8N
This table gives cross-reference parts and alternative options found for EP4CGX150DF31C8N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP4CGX150DF31C8N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| EP4CGX150DF31C7N | Altera Corporation | $488.6000 | Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA896, 31 X 31 MM, 1 MM PITCH, LEAD FREE, FBGA-896 | EP4CGX150DF31C8N vs EP4CGX150DF31C7N |
| EP4CGX150DF31C8 | Intel Corporation | Check for Price | Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA896, 31 X 31 MM, 1 MM PITCH, FBGA-896 | EP4CGX150DF31C8N vs EP4CGX150DF31C8 |
| EP4CGX150DF31C8N | Altera Corporation | Check for Price | Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA896, 31 X 31 MM, 1 MM PITCH, LEAD FREE, FBGA-896 | EP4CGX150DF31C8N vs EP4CGX150DF31C8N |
| EP4CGX150DF31I7 | Intel Corporation | Check for Price | Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA896, 31 X 31 MM, 1 MM PITCH, FBGA-896 | EP4CGX150DF31C8N vs EP4CGX150DF31I7 |
| EP4CGX150DF31C7N | Intel Corporation | Check for Price | Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA896, 31 X 31 MM, 1 MM PITCH, LEAD FREE, FBGA-896 | EP4CGX150DF31C8N vs EP4CGX150DF31C7N |
| EP4CGX150DF31C7 | Intel Corporation | Check for Price | Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA896, 31 X 31 MM, 1 MM PITCH, FBGA-896 | EP4CGX150DF31C8N vs EP4CGX150DF31C7 |
| EP4CGX150DF31I7 | Altera Corporation | Check for Price | Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA896, 31 X 31 MM, 1 MM PITCH, FBGA-896 | EP4CGX150DF31C8N vs EP4CGX150DF31I7 |
EP4CGX150DF31C8N Frequently Asked Questions (FAQ)
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The maximum power consumption of EP4CGX150DF31C8N is approximately 12W, but it can vary depending on the specific use case and operating conditions.
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To implement a reliable clocking scheme, you should use a high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL), and ensure that the clock signal is properly routed and terminated on the board. Additionally, you should follow Intel's guidelines for clocking and clock domain crossing.
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The recommended PCB layout and stackup for EP4CGX150DF31C8N involves using a high-speed, low-loss material, such as FR4 or Rogers 4350, with a minimum of 4 layers (2 signal, 2 power). The FPGA should be placed in the center of the board, with power planes and decoupling capacitors nearby. Signal traces should be short, direct, and impedance-controlled, with minimal vias and stubs.
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To ensure signal integrity and reduce EMI, you should follow best practices for high-speed design, such as using differential signaling, impedance matching, and termination. You should also use shielding, filtering, and grounding techniques to reduce EMI. Additionally, you should simulate and analyze your design using tools such as IBIS and HyperLynx to identify and mitigate potential issues.
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The EP4CGX150DF31C8N has a maximum junction temperature of 100°C. To ensure reliable operation, you should provide adequate heat sinking, such as a heat sink or thermal interface material, and ensure good airflow around the device. You should also follow Intel's guidelines for thermal management and consider using thermal simulation tools to optimize your design.