Part Details for EP3SL150F1152I3G by Intel Corporation
Results Overview of EP3SL150F1152I3G by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
EP3SL150F1152I3G Information
EP3SL150F1152I3G by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for EP3SL150F1152I3G
EP3SL150F1152I3G CAD Models
EP3SL150F1152I3G Part Data Attributes
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EP3SL150F1152I3G
Intel Corporation
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Datasheet
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EP3SL150F1152I3G
Intel Corporation
Field Programmable Gate Array, PBGA1152, FBGA-1152
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
JESD-30 Code | S-PBGA-B1152 | |
Length | 35 mm | |
Number of CLBs | 5700 | |
Number of Inputs | 744 | |
Number of Logic Cells | 142500 | |
Number of Outputs | 744 | |
Number of Terminals | 1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 5700 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 3.5 mm | |
Supply Voltage-Max | 0.94 V | |
Supply Voltage-Min | 0.86 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 35 mm |
Alternate Parts for EP3SL150F1152I3G
This table gives cross-reference parts and alternative options found for EP3SL150F1152I3G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP3SL150F1152I3G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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EP3SL150F1152C3L | Intel Corporation | Check for Price | Field Programmable Gate Array, 100MHz, 142500-Cell, CMOS, PBGA1152 | EP3SL150F1152I3G vs EP3SL150F1152C3L |
EP3SL150F1152C3N | Altera Corporation | Check for Price | Field Programmable Gate Array, 717MHz, 142500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP3SL150F1152I3G vs EP3SL150F1152C3N |
EP3SL150F1152C3 | Altera Corporation | Check for Price | Field Programmable Gate Array, 717MHz, 142500-Cell, CMOS, PBGA1152, FBGA-1152 | EP3SL150F1152I3G vs EP3SL150F1152C3 |
EP3SL150F1152C3LN | Intel Corporation | Check for Price | Field Programmable Gate Array, 100MHz, 142500-Cell, CMOS, PBGA1152 | EP3SL150F1152I3G vs EP3SL150F1152C3LN |
EP3SL150F1152I3 | Intel Corporation | Check for Price | Field Programmable Gate Array, 3600000 Gates, 717MHz, 142500-Cell, CMOS, PBGA1152, FBGA-1152 | EP3SL150F1152I3G vs EP3SL150F1152I3 |
EP3SL150F1152I3N | Intel Corporation | Check for Price | Field Programmable Gate Array, 3600000 Gates, 717MHz, 142500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP3SL150F1152I3G vs EP3SL150F1152I3N |
EP3SL150F1152I3N | Altera Corporation | Check for Price | Field Programmable Gate Array, 3600000 Gates, 717MHz, 142500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP3SL150F1152I3G vs EP3SL150F1152I3N |
EP3SL150F1152I3G Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide for Stratix III FPGAs, which includes recommendations for layer stackup, signal routing, and decoupling. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
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To optimize power consumption, use Intel's PowerPlay Early Power Estimator (EPE) tool to estimate power consumption based on your design. Implement power-saving techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling. For thermal management, ensure proper airflow, use a heat sink, and consider using a thermal interface material (TIM) to reduce thermal resistance.
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Use Intel's Quartus II software to configure the PLLs and clock management. Follow the guidelines for clock domain crossing, clock tree synthesis, and PLL configuration. Ensure that the clock frequencies and phases are properly set, and use the built-in clock monitoring and debugging features to verify correct operation.
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Use Intel's Quartus II software to generate a secure configuration file, and implement authentication and encryption mechanisms to prevent unauthorized access. Consider using a secure boot mechanism, such as Intel's Secure Boot, to ensure the FPGA configuration is authentic and trusted.
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The EP3SL150F1152I3G FPGA's high-speed transceivers have specific requirements for PCB layout, signal integrity, and clocking. Ensure that the transceiver lanes are properly routed, and follow Intel's guidelines for transmitter and receiver equalization, clock data recovery, and channel bonding.