Part Details for EP3SE110F1152I4N by Intel Corporation
Results Overview of EP3SE110F1152I4N by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (8 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
EP3SE110F1152I4N Information
EP3SE110F1152I4N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for EP3SE110F1152I4N
Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018, Lead time:1-2weeks | 87 Stock,253 Available |
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$1,354.3700 / $1,720.7200 | Buy Now |
Part Details for EP3SE110F1152I4N
EP3SE110F1152I4N CAD Models
EP3SE110F1152I4N Part Data Attributes
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EP3SE110F1152I4N
Intel Corporation
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Datasheet
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EP3SE110F1152I4N
Intel Corporation
Field Programmable Gate Array, 717MHz, 107500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1152 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Additional Feature | IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY | |
JESD-30 Code | S-PBGA-B1152 | |
Length | 35 mm | |
Number of CLBs | 4300 | |
Number of Inputs | 744 | |
Number of Logic Cells | 107500 | |
Number of Outputs | 744 | |
Number of Terminals | 1152 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 4300 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.5 mm | |
Supply Voltage-Max | 0.94 V | |
Supply Voltage-Min | 0.86 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 35 mm |
Alternate Parts for EP3SE110F1152I4N
This table gives cross-reference parts and alternative options found for EP3SE110F1152I4N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP3SE110F1152I4N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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EP3SE110F1152I4N | Altera Corporation | $3,631.2500 | Field Programmable Gate Array, 717MHz, 107500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP3SE110F1152I4N vs EP3SE110F1152I4N |
EP3SE110F1152I4L | Altera Corporation | Check for Price | Field Programmable Gate Array, 717MHz, 107500-Cell, CMOS, PBGA1152, FBGA-1152 | EP3SE110F1152I4N vs EP3SE110F1152I4L |
EP3SE110F1152I4LG | Intel Corporation | Check for Price | Field Programmable Gate Array, 4300 CLBs, 107500-Cell, PBGA1152, FBGA-1152 | EP3SE110F1152I4N vs EP3SE110F1152I4LG |
EP3SE110F1152C4LN | Intel Corporation | Check for Price | Field Programmable Gate Array, 717MHz, 107500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP3SE110F1152I4N vs EP3SE110F1152C4LN |
EP3SE110F1152C4LN | Altera Corporation | Check for Price | Field Programmable Gate Array, 717MHz, 107500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP3SE110F1152I4N vs EP3SE110F1152C4LN |
EP3SE110F1152C4N | Intel Corporation | Check for Price | Field Programmable Gate Array, 717MHz, 107500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP3SE110F1152I4N vs EP3SE110F1152C4N |
EP3SE110F1152C4N | Altera Corporation | Check for Price | Field Programmable Gate Array, 717MHz, 107500-Cell, CMOS, PBGA1152, LEAD FREE, FBGA-1152 | EP3SE110F1152I4N vs EP3SE110F1152C4N |
EP3SE110F1152I4G | Intel Corporation | Check for Price | Field Programmable Gate Array, 4300 CLBs, 107500-Cell, PBGA1152, FBGA-1152 | EP3SE110F1152I4N vs EP3SE110F1152I4G |
EP3SE110F1152I4N Frequently Asked Questions (FAQ)
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Intel provides a PCB design guide for Stratix III FPGAs, which includes recommendations for layer stackup, signal routing, and decoupling. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
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To optimize power consumption, use Intel's PowerPlay power analysis tool to estimate power consumption and identify areas for optimization. Implement power-gating, clock-gating, and dynamic voltage and frequency scaling (DVFS) techniques. For thermal management, ensure proper airflow, use thermal interface materials, and consider heat sinks or fans if necessary.
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Use Intel's Quartus II software to configure PLLs and clock domains. Ensure that clock domains are properly isolated, and use clock domain crossing (CDC) techniques to handle asynchronous clock domains. Also, follow Intel's guidelines for PLL configuration, clock skew management, and clock tree synthesis.
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Use Intel's Quartus II software to generate a secure configuration bitstream. Implement configuration encryption, authentication, and integrity checking using Intel's FPGA configuration security features. Also, ensure that the configuration data is stored securely and transmitted securely to the FPGA.
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High-speed transceivers have limitations on data rate, cable length, and signal integrity. Ensure that the transceiver settings are properly configured, and signal integrity is maintained by following Intel's guidelines for transmitter and receiver equalization, clock data recovery, and channel bonding.