Datasheets
EP3C5F256C8N by:

Field Programmable Gate Array, 5136 CLBs, 472.5MHz, 5136-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256

Part Details for EP3C5F256C8N by Intel Corporation

Results Overview of EP3C5F256C8N by Intel Corporation

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Applications Education and Research Industrial Automation Computing and Data Storage Renewable Energy Electronic Manufacturing Robotics and Drones

EP3C5F256C8N Information

EP3C5F256C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for EP3C5F256C8N

Part # Distributor Description Stock Price Buy
Velocity Electronics Our Stock 143
RFQ
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 1010
  • 1 $32.8800
  • 25 $31.8800
  • 100 $28.9900
$28.9900 / $32.8800 Buy Now

Part Details for EP3C5F256C8N

EP3C5F256C8N CAD Models

EP3C5F256C8N Part Data Attributes

EP3C5F256C8N Intel Corporation
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EP3C5F256C8N Intel Corporation Field Programmable Gate Array, 5136 CLBs, 472.5MHz, 5136-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEL CORP
Package Description 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel
Clock Frequency-Max 472.5 MHz
JESD-30 Code R-PBGA-B256
JESD-609 Code e1
Length 17 mm
Moisture Sensitivity Level 3
Number of CLBs 5136
Number of Inputs 182
Number of Logic Cells 5136
Number of Outputs 182
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 5136 CLBS
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

Alternate Parts for EP3C5F256C8N

This table gives cross-reference parts and alternative options found for EP3C5F256C8N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP3C5F256C8N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
EP3C5F256I7N Intel Corporation Check for Price Field Programmable Gate Array, 5136 CLBs, 472.5MHz, 5136-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 EP3C5F256C8N vs EP3C5F256I7N

EP3C5F256C8N Related Parts

EP3C5F256C8N Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the EP3C5F256C8N is -40°C to 100°C.

  • To implement a clock domain crossing (CDC) in the EP3C5F256C8N, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.

  • The recommended power-up sequence for the EP3C5F256C8N is to apply power to the VCCINT and VCCAUX pins simultaneously, followed by the configuration clock (CCLK) and then the data inputs.

  • To optimize timing closure for the EP3C5F256C8N, use the Intel Quartus II software to analyze and optimize the design's timing, and consider using pipelining, retiming, and clock domain crossing techniques.

  • The maximum current draw for the EP3C5F256C8N is 1.5 A for the VCCINT pin and 100 mA for the VCCAUX pin.

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