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Field Programmable Gate Array, 5136 CLBs, 472.5MHz, 5136-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256
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EP3C5F256C8N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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Velocity Electronics | Our Stock | 143 |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018 | 1010 |
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$28.9900 / $32.8800 | Buy Now |
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EP3C5F256C8N
Intel Corporation
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Datasheet
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EP3C5F256C8N
Intel Corporation
Field Programmable Gate Array, 5136 CLBs, 472.5MHz, 5136-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Clock Frequency-Max | 472.5 MHz | |
JESD-30 Code | R-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 5136 | |
Number of Inputs | 182 | |
Number of Logic Cells | 5136 | |
Number of Outputs | 182 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 5136 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |
This table gives cross-reference parts and alternative options found for EP3C5F256C8N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP3C5F256C8N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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EP3C5F256I7N | Intel Corporation | Check for Price | Field Programmable Gate Array, 5136 CLBs, 472.5MHz, 5136-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 | EP3C5F256C8N vs EP3C5F256I7N |
The maximum operating temperature range for the EP3C5F256C8N is -40°C to 100°C.
To implement a clock domain crossing (CDC) in the EP3C5F256C8N, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.
The recommended power-up sequence for the EP3C5F256C8N is to apply power to the VCCINT and VCCAUX pins simultaneously, followed by the configuration clock (CCLK) and then the data inputs.
To optimize timing closure for the EP3C5F256C8N, use the Intel Quartus II software to analyze and optimize the design's timing, and consider using pipelining, retiming, and clock domain crossing techniques.
The maximum current draw for the EP3C5F256C8N is 1.5 A for the VCCINT pin and 100 mA for the VCCAUX pin.