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Field Programmable Gate Array, 55856 CLBs, 472.5MHz, 55856-Cell, CMOS, PBGA484, 19 X 19 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-484
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EP3C55U484I7N by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
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EP3C55U484I7N
Intel Corporation
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Datasheet
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EP3C55U484I7N
Intel Corporation
Field Programmable Gate Array, 55856 CLBs, 472.5MHz, 55856-Cell, CMOS, PBGA484, 19 X 19 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-484
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 19 X 19 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-484 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Clock Frequency-Max | 472.5 MHz | |
JESD-30 Code | R-PBGA-B484 | |
JESD-609 Code | e1 | |
Length | 19 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 55856 | |
Number of Inputs | 327 | |
Number of Logic Cells | 55856 | |
Number of Outputs | 327 | |
Number of Terminals | 484 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 55856 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA484,22X22,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.2 mm | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm |
This table gives cross-reference parts and alternative options found for EP3C55U484I7N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP3C55U484I7N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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EP3C55U484C7N | Intel Corporation | Check for Price | Field Programmable Gate Array, 55856 CLBs, 472.5MHz, 55856-Cell, CMOS, PBGA484, 19 X 19 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-484 | EP3C55U484I7N vs EP3C55U484C7N |
The EP3C55U484I7N has an industrial temperature range of -40°C to 100°C, making it suitable for use in harsh environments.
To implement a CDC in the EP3C55U484I7N, use the Intel FPGA IP Catalog to generate a CDC module, or use a synchronizer circuit with a FIFO or a gray counter to transfer data between clock domains.
The maximum frequency achievable with the EP3C55U484I7N depends on the specific design and implementation, but Intel claims a maximum clock frequency of up to 500 MHz for this device.
To optimize power consumption, use the Intel Quartus II Power Analyzer to identify power-hungry components, and apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
Yes, the EP3C55U484I7N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high reliability and fault-tolerant features.