Part Details for EP2S30F484C3 by Intel Corporation
Results Overview of EP2S30F484C3 by Intel Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
EP2S30F484C3 Information
EP2S30F484C3 by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for EP2S30F484C3
Part # | Distributor | Description | Stock | Price | Buy | |
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MacroQuest Electronics | ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018, Lead time:1-2weeks | 61 Stock,238 Available |
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$812.8700 / $1,032.7400 | Buy Now |
Part Details for EP2S30F484C3
EP2S30F484C3 CAD Models
EP2S30F484C3 Part Data Attributes
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EP2S30F484C3
Intel Corporation
Buy Now
Datasheet
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EP2S30F484C3
Intel Corporation
Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Package Description | 23 X 23 MM, 1 MM PITCH, FBGA-484 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Clock Frequency-Max | 717 MHz | |
Combinatorial Delay of a CLB-Max | 4.45 ns | |
JESD-30 Code | S-PBGA-B484 | |
JESD-609 Code | e0 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 13552 | |
Number of Inputs | 342 | |
Number of Logic Cells | 33880 | |
Number of Outputs | 334 | |
Number of Terminals | 484 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 13552 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.5 mm | |
Supply Voltage-Max | 1.25 V | |
Supply Voltage-Min | 1.15 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm |
Alternate Parts for EP2S30F484C3
This table gives cross-reference parts and alternative options found for EP2S30F484C3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP2S30F484C3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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EP2S30F484C3N | Intel Corporation | Check for Price | Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 | EP2S30F484C3 vs EP2S30F484C3N |
EP2S30F484C3 Frequently Asked Questions (FAQ)
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The maximum operating temperature range for EP2S30F484C3 is -40°C to 100°C, as per the Intel datasheet. However, it's recommended to operate within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.
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To implement clock domain crossing (CDC) in EP2S30F484C3, you need to use synchronizers or FIFOs to transfer data between clock domains. Intel provides guidelines and IP cores for CDC implementation in their documentation and development kits.
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The maximum power consumption of EP2S30F484C3 depends on the device configuration, operating frequency, and voltage. According to the datasheet, the maximum power consumption is around 2.5W. However, it's recommended to perform power analysis using Intel's PowerPlay Early Power Estimator (EPE) tool for accurate power estimation.
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To optimize the performance of EP2S30F484C3, you can use Intel's Quartus II software to optimize the design for area, speed, and power. Additionally, you can use techniques such as pipelining, parallel processing, and clock gating to improve performance.
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The maximum frequency of operation for EP2S30F484C3 is around 500 MHz, depending on the device configuration and operating conditions. However, it's recommended to check the datasheet and Intel's documentation for specific frequency limitations and guidelines.