Datasheets
EP2S30F484C3 by:

Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484

Part Details for EP2S30F484C3 by Intel Corporation

Results Overview of EP2S30F484C3 by Intel Corporation

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Applications Security and Surveillance Virtual Reality (VR), Augmented Reality (AR), and Vision Systems

EP2S30F484C3 Information

EP2S30F484C3 by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for EP2S30F484C3

Part # Distributor Description Stock Price Buy
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018, Lead time:1-2weeks 61 Stock,238 Available
  • 1 $1,032.7400
  • 5 $959.4500
  • 10 $886.1600
  • 24 $812.8700
$812.8700 / $1,032.7400 Buy Now

Part Details for EP2S30F484C3

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EP2S30F484C3 Part Data Attributes

EP2S30F484C3 Intel Corporation
Buy Now Datasheet
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EP2S30F484C3 Intel Corporation Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Package Description 23 X 23 MM, 1 MM PITCH, FBGA-484
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Clock Frequency-Max 717 MHz
Combinatorial Delay of a CLB-Max 4.45 ns
JESD-30 Code S-PBGA-B484
JESD-609 Code e0
Length 23 mm
Moisture Sensitivity Level 3
Number of CLBs 13552
Number of Inputs 342
Number of Logic Cells 33880
Number of Outputs 334
Number of Terminals 484
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 13552 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA484,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 1.25 V
Supply Voltage-Min 1.15 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm

Alternate Parts for EP2S30F484C3

This table gives cross-reference parts and alternative options found for EP2S30F484C3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP2S30F484C3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
EP2S30F484C3N Intel Corporation Check for Price Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484C3N
Part Number Manufacturer Composite Price Description Compare
EP2S30F484C5N Altera Corporation $465.7500 Field Programmable Gate Array, 13552 CLBs, 640MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484C5N
EP2S30F484I4N Altera Corporation $741.7500 Field Programmable Gate Array, 1694 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 EP2S30F484C3 vs EP2S30F484I4N
EP2S30F484I4 Altera Corporation $815.9200 Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484I4
EP2S30F484C4N Intel Corporation Check for Price Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484C4N
EP2S30F484C5 Altera Corporation Check for Price Field Programmable Gate Array, 13552 CLBs, 640MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484C5
EP2S30F484I4N Intel Corporation Check for Price Field Programmable Gate Array, 1694 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 EP2S30F484C3 vs EP2S30F484I4N
EP2S30F484I4 Intel Corporation Check for Price Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484I4
EP2S30F484C5 Intel Corporation Check for Price Field Programmable Gate Array, 13552 CLBs, 640MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484C5
EP2S30F484C4 Intel Corporation Check for Price Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484C4
EP2S30F484C3N Altera Corporation Check for Price Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 EP2S30F484C3 vs EP2S30F484C3N

EP2S30F484C3 Related Parts

EP2S30F484C3 Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for EP2S30F484C3 is -40°C to 100°C, as per the Intel datasheet. However, it's recommended to operate within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.

  • To implement clock domain crossing (CDC) in EP2S30F484C3, you need to use synchronizers or FIFOs to transfer data between clock domains. Intel provides guidelines and IP cores for CDC implementation in their documentation and development kits.

  • The maximum power consumption of EP2S30F484C3 depends on the device configuration, operating frequency, and voltage. According to the datasheet, the maximum power consumption is around 2.5W. However, it's recommended to perform power analysis using Intel's PowerPlay Early Power Estimator (EPE) tool for accurate power estimation.

  • To optimize the performance of EP2S30F484C3, you can use Intel's Quartus II software to optimize the design for area, speed, and power. Additionally, you can use techniques such as pipelining, parallel processing, and clock gating to improve performance.

  • The maximum frequency of operation for EP2S30F484C3 is around 500 MHz, depending on the device configuration and operating conditions. However, it's recommended to check the datasheet and Intel's documentation for specific frequency limitations and guidelines.

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