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Programmable Logic / Field Programmable Gate Arrays / EP1S10F780C7
Datasheets
EP1S10F780C7 by:

Field Programmable Gate Array, 1200 CLBs, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780

Part Details for EP1S10F780C7 by Intel Corporation

Results Overview of EP1S10F780C7 by Intel Corporation

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Applications Education and Research Space Technology Industrial Automation Computing and Data Storage Aerospace and Defense Electronic Manufacturing

EP1S10F780C7 Information

EP1S10F780C7 by Intel Corporation is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for EP1S10F780C7

Part # Distributor Description Stock Price Buy
MacroQuest Electronics ISO 9001: 2015, ISO 14001:2015, ISO 45001:2018, Lead time:1-2weeks 6 Stock,90 Available
  • 1 $271.4700
  • 5 $252.2100
  • 10 $232.9400
  • 24 $213.6700
$213.6700 / $271.4700 Buy Now

Part Details for EP1S10F780C7

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EP1S10F780C7 Part Data Attributes

Parametric Data
EP1S10F780C7 Intel Corporation
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EP1S10F780C7 Intel Corporation Field Programmable Gate Array, 1200 CLBs, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Package Description 29 X 29 MM, 1 MM PITCH, FBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B780
JESD-609 Code e0
Length 29 mm
Moisture Sensitivity Level 3
Number of CLBs 1200
Number of Inputs 426
Number of Logic Cells 10570
Number of Outputs 426
Number of Terminals 780
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1057 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm

Alternate Parts for EP1S10F780C7

This table gives cross-reference parts and alternative options found for EP1S10F780C7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EP1S10F780C7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
EP1S10F780C7N Intel Corporation Check for Price Field Programmable Gate Array, 1200 CLBs, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 EP1S10F780C7 vs EP1S10F780C7N
EP1S10F780I7 Altera Corporation Check for Price Field Programmable Gate Array, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780I7
EP1S10F780I7 Intel Corporation Check for Price Field Programmable Gate Array, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780I7
EP1S10F780I7ES Intel Corporation Check for Price Field Programmable Gate Array, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780I7ES
Part Number Manufacturer Composite Price Description Compare
EP1S10F780C7ES Altera Corporation Check for Price Field Programmable Gate Array, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780C7ES
EP1S10F780C7ES Intel Corporation Check for Price Field Programmable Gate Array, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780C7ES
EP1S10F780C6N Altera Corporation Check for Price Field Programmable Gate Array, 1200 CLBs, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 EP1S10F780C7 vs EP1S10F780C6N
EP1S10F780I5 Intel Corporation Check for Price Field Programmable Gate Array, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780I5
EP1S10F780I6 Altera Corporation Check for Price Field Programmable Gate Array, 1200 CLBs, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780I6
EP1S10F780C5ES Altera Corporation Check for Price Field Programmable Gate Array, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780C5ES
EP1S10F780C5N Altera Corporation Check for Price Field Programmable Gate Array, 1200 CLBs, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 EP1S10F780C7 vs EP1S10F780C5N
EP1S10F780I7ES Altera Corporation Check for Price Field Programmable Gate Array, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780I7ES
EP1S10F780I6N Intel Corporation Check for Price Field Programmable Gate Array, 1200 CLBs, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780 EP1S10F780C7 vs EP1S10F780I6N
EP1S10F780C5 Intel Corporation Check for Price Field Programmable Gate Array, 1200 CLBs, 10570-Cell, CMOS, PBGA780, 29 X 29 MM, 1 MM PITCH, FBGA-780 EP1S10F780C7 vs EP1S10F780C5

EP1S10F780C7 Related Parts

EP1S10F780C7 Frequently Asked Questions (FAQ)

  • Intel provides a PCB design guide for Stratix FPGAs, which includes recommendations for layer stackup, signal routing, and decoupling. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).

  • To optimize power consumption, use Intel's PowerPlay Early Power Estimator (EPE) tool to estimate power consumption based on your design. Implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and use low-power modes. For thermal management, ensure proper airflow, use heat sinks or thermal interfaces, and monitor temperature using on-chip thermal sensors.

  • Use Intel's Quartus II software for design entry, synthesis, and place-and-route. Follow the recommended design flow, and use the Intel FPGA Software Development Kit (SDK) for programming and debugging. Ensure that your design meets timing and area constraints, and use the built-in debugging tools to identify and fix issues.

  • Implement error detection and correction mechanisms, such as ECC (Error-Correcting Code) for memory and data transmission. Use redundant logic and voting mechanisms for critical functions. Also, consider using Intel's built-in features like CRC (Cyclic Redundancy Check) and parity bits for data integrity.

  • Use Intel's security features like AES (Advanced Encryption Standard) and SHA (Secure Hash Algorithm) for data encryption and authentication. Implement secure boot mechanisms, and use anti-tamper and anti-reverse engineering techniques like obfuscation and encryption of sensitive data.

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