Part Details for DSPB56362AG120R2 by NXP Semiconductors
Results Overview of DSPB56362AG120R2 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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DSPB56362AG120R2 Information
DSPB56362AG120R2 by NXP Semiconductors is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for DSPB56362AG120R2
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 25354 |
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Part Details for DSPB56362AG120R2
DSPB56362AG120R2 CAD Models
DSPB56362AG120R2 Part Data Attributes
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DSPB56362AG120R2
NXP Semiconductors
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Datasheet
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DSPB56362AG120R2
NXP Semiconductors
Digital Signal Processor
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Finish | Tin (Sn) | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
DSPB56362AG120R2 Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout and thermal management guide in the application note AN11961. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
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To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unused peripherals, and use the power-saving modes (e.g., doze, sleep, and deep sleep) provided by the processor. Additionally, optimize your software to reduce CPU usage and leverage the device's low-power modes.
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To ensure EMC and EMI compliance, follow NXP's guidelines for PCB layout, component selection, and shielding. Additionally, consider using EMI filters, ferrite beads, and shielding cans to minimize radiation and susceptibility. Consult the NXP application note AN11533 for more information.
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Implement a secure boot mechanism using the device's built-in security features, such as the Secure Boot mechanism, which ensures that only authorized firmware is executed. Additionally, use secure protocols for firmware updates and consider implementing a secure key storage mechanism.
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The internal flash memory has limitations on endurance (number of write cycles) and data retention. Ensure that your application takes these limitations into account, and consider using external memory or wear-leveling techniques to extend the lifespan of the internal flash.