Part Details for DSPA56371AF180 by NXP Semiconductors
Results Overview of DSPA56371AF180 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
DSPA56371AF180 Information
DSPA56371AF180 by NXP Semiconductors is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for DSPA56371AF180
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock | 2430 |
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RFQ |
Part Details for DSPA56371AF180
DSPA56371AF180 CAD Models
DSPA56371AF180 Part Data Attributes
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DSPA56371AF180
NXP Semiconductors
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Datasheet
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DSPA56371AF180
NXP Semiconductors
IC,DSP,24-BIT,CMOS,QFP,80PIN,PLASTIC
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 24 | |
| Format | FIXED POINT | |
| JESD-30 Code | S-PQFP-G80 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 80 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP80,.64SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 86016 | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 |
Alternate Parts for DSPA56371AF180
This table gives cross-reference parts and alternative options found for DSPA56371AF180. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DSPA56371AF180, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| DSPA56371AF180 | Motorola Semiconductor Products | Check for Price | Digital Signal Processor, 24-Bit Size, CMOS, PQFP80, | DSPA56371AF180 vs DSPA56371AF180 |
DSPA56371AF180 Frequently Asked Questions (FAQ)
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NXP provides a recommended PCB layout guide in the application note AN12213, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
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Optimizing power consumption requires careful consideration of clock frequency, voltage scaling, and power gating. NXP provides guidelines in the application note AN12214, which includes tips on reducing power consumption in different operating modes.
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The recommended settings for the PLL and clock domains can be found in the NXP documentation, including the datasheet and application notes. It's essential to follow these guidelines to ensure proper clocking and synchronization.
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A reliable boot mechanism can be implemented using a combination of hardware and software techniques, such as using a boot loader, configuring the boot mode pins, and implementing a secure boot process. NXP provides guidelines and examples in the application note AN12215.
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The DSPA56371AF180's memory interfaces have limitations on bandwidth, latency, and capacity. It's essential to understand these limitations to ensure proper system design and performance. NXP provides detailed information on the memory interfaces in the datasheet and application notes.