Part Details for DSI30-08AC by IXYS Corporation
Results Overview of DSI30-08AC by IXYS Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Industrial Automation
Aerospace and Defense
Energy and Power Systems
Electronic Manufacturing
DSI30-08AC Information
DSI30-08AC by IXYS Corporation is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for DSI30-08AC
| Part # | Distributor | Description | Stock | Price | Buy | |
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New Advantage Corporation | DIODE STAND. Single 30A 800V THT ISOPLUS220 RoHS: Compliant Min Qty: 1 Package Multiple: 100 | 331 |
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$4.8900 / $5.2900 | Buy Now |
Part Details for DSI30-08AC
DSI30-08AC CAD Models
DSI30-08AC Part Data Attributes
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DSI30-08AC
IXYS Corporation
Buy Now
Datasheet
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DSI30-08AC
IXYS Corporation
Rectifier Diode, 1 Phase, 1 Element, 30A, 800V V(RRM), Silicon, PLASTIC, ISOPLUS220, 2 PIN
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | IXYS CORP | |
| Package Description | ISOPLUS220, 2 PIN | |
| Pin Count | 2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Application | GENERAL PURPOSE | |
| Case Connection | ISOLATED | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| JESD-30 Code | R-PSIP-T2 | |
| JESD-609 Code | e1 | |
| Non-rep Pk Forward Current-Max | 185 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Current-Max | 30 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Rep Pk Reverse Voltage-Max | 800 V | |
| Surface Mount | NO | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | SINGLE |
DSI30-08AC Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the device, using a large copper area for heat dissipation, and keeping the thermal path as short as possible. A minimum of 2 oz copper thickness is recommended.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves, ensure good thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
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The DSI30-08AC has an internal ESD protection diode, but it is still recommended to follow standard ESD handling procedures to prevent damage. A human body model (HBM) of 2 kV and a machine model (MM) of 200 V are recommended.
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Yes, the DSI30-08AC can be used in a parallel configuration to increase current handling, but it is essential to ensure that the devices are matched for optimal performance and to follow the recommended layout and thermal management guidelines.
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The recommended storage and handling procedure for the DSI30-08AC involves storing the devices in their original packaging, avoiding exposure to moisture, and following standard ESD handling procedures.