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Part Details for DS72060W200FPV by Renesas Electronics Corporation
Results Overview of DS72060W200FPV by Renesas Electronics Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
DS72060W200FPV Information
DS72060W200FPV by Renesas Electronics Corporation is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for DS72060W200FPV
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
23AH3158
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Newark | Mcu, 32Bit, 200Mhz, Lqfp-176, Product Range:Superh Family Sh7200 Series Sh7206 Group Microcontrollers, Device Core:Sh-2A, Data Bus Width:32 Bit, Operating Frequency Max:200Mhz, Program Memory Size:-, No. Of Pins:176Pins Rohs Compliant: Yes |Renesas DS72060W200FPV RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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Buy Now | |
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DISTI #
DS72060W200FPV-ND
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DigiKey | IC MCU 32BIT ROMLESS 176LFQFP Min Qty: 1 Lead time: 36 Weeks Container: Tray |
65 In Stock |
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$30.1075 / $40.4900 | Buy Now |
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Rochester Electronics | 32-bit Microcontrollers RoHS: Compliant Status: Obsolete Min Qty: 1 | 4 |
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$78.7500 / $98.4400 | Buy Now |
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DISTI #
DS72060W200FPV
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Avnet Asia | MCU 32-bit SuperH RISC ROMLess 3.3V 176-Pin LQFP (Alt: DS72060W200FPV) RoHS: Compliant Min Qty: 240 Package Multiple: 24 | 0 |
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RFQ | |
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DISTI #
DS72060W200FPV
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Avnet Silica | MCU 32bit SuperH RISC ROMLess 33V 176Pin LQFP (Alt: DS72060W200FPV) RoHS: Compliant Min Qty: 72 Package Multiple: 24 | Silica - 0 |
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Buy Now |
Part Details for DS72060W200FPV
DS72060W200FPV CAD Models
DS72060W200FPV Part Data Attributes
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DS72060W200FPV
Renesas Electronics Corporation
Buy Now
Datasheet
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DS72060W200FPV
Renesas Electronics Corporation
32-bit Microcontrollers (Non Promotion), LQFP, /
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | LQFP | |
| Package Description | 24 X 24 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, LFQFP-176 | |
| Pin Count | 176 | |
| Manufacturer Package Code | PLQP0176KD | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Has ADC | YES | |
| Additional Feature | ALSO OPERATES MINI SUPPLY 4V AT 16 MHZ | |
| Address Bus Width | 26 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 66.67 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PQFP-G176 | |
| Length | 24 mm | |
| Number of I/O Lines | 78 | |
| Number of Terminals | 176 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.7 mm | |
| Speed | 200 MHz | |
| Supply Voltage-Max | 1.35 V | |
| Supply Voltage-Min | 1.15 V | |
| Supply Voltage-Nom | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 24 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
DS72060W200FPV Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
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Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal protection circuits and over-temperature shutdown mechanisms.
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The critical timing parameters include the clock frequency, setup and hold times, and rise and fall times for the interfaces such as SPI, I2C, and UART. Refer to the datasheet for specific values and ensure that the system design meets these requirements.
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The device requires a specific power sequencing and voltage ramp-up/ramp-down sequence to ensure reliable operation. Refer to the datasheet for the recommended power-up and power-down sequences, and ensure that the power supply design meets these requirements.
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The device has built-in ESD protection, but additional external protection measures such as TVS diodes and resistors may be required depending on the system design. Latch-up prevention measures include using a latch-up immune design and following the recommended PCB layout guidelines.