Part Details for DS16F95WFQMLV by National Semiconductor Corporation
Results Overview of DS16F95WFQMLV by National Semiconductor Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
DS16F95WFQMLV Information
DS16F95WFQMLV by National Semiconductor Corporation is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for DS16F95WFQMLV
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 53 |
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RFQ | ||
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Quest Components | LINE TRANSCEIVER, 1 FUNC, 1 DRIVER, 1 RCVR, BIPOLAR, CDFP10 | 42 |
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$336.0000 / $392.0000 | Buy Now |
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Quest Components | LINE TRANSCEIVER, 1 FUNC, 1 DRIVER, 1 RCVR, BIPOLAR, CDFP10 | 13 |
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$600.0000 / $700.0000 | Buy Now |
Part Details for DS16F95WFQMLV
DS16F95WFQMLV CAD Models
DS16F95WFQMLV Part Data Attributes
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DS16F95WFQMLV
National Semiconductor Corporation
Buy Now
Datasheet
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DS16F95WFQMLV
National Semiconductor Corporation
IC LINE TRANSCEIVER, CDFP10, CERAMIC, DFP-10, Line Driver or Receiver
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | CERAMIC, DFP-10 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Differential Output | YES | |
Driver Number of Bits | 1 | |
High Level Input Current-Max | 0.00002 A | |
Input Characteristics | DIFFERENTIAL SCHMITT TRIGGER | |
Interface IC Type | LINE TRANSCEIVER | |
Interface Standard | EIA-422-A; EIA-485; SCSI-1 | |
JESD-30 Code | R-CDFP-F10 | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 10 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Out Swing-Min | 1.5 V | |
Output Low Current-Max | 0.016 A | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | DFP | |
Package Equivalence Code | FL10,.3 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Receive Delay-Max | 38 ns | |
Receiver Number of Bits | 1 | |
Screening Level | MIL-PRF-38535 Class V | |
Seated Height-Max | 2.032 mm | |
Supply Current-Max | 28 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | FLAT | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Total Dose | 300k Rad(Si) V | |
Transmit Delay-Max | 25 ns | |
Width | 6.1 mm |
Alternate Parts for DS16F95WFQMLV
This table gives cross-reference parts and alternative options found for DS16F95WFQMLV. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DS16F95WFQMLV, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
5962-8961501HA | National Semiconductor Corporation | Check for Price | IC LINE TRANSCEIVER, CDFP10, CEREMIC, DFP-10, Line Driver or Receiver | DS16F95WFQMLV vs 5962-8961501HA |
5962F8961501QHX | National Semiconductor Corporation | Check for Price | IC LINE TRANSCEIVER, CDFP10, CERPACK-10, Line Driver or Receiver | DS16F95WFQMLV vs 5962F8961501QHX |
5962-8961501HA | Texas Instruments | Check for Price | LINE TRANSCEIVER, CDFP10, CEREMIC, DFP-10 | DS16F95WFQMLV vs 5962-8961501HA |
5962-8961501VHX | Texas Instruments | Check for Price | LINE TRANSCEIVER, CDFP10, CERAMIC, SOIC-10 | DS16F95WFQMLV vs 5962-8961501VHX |
DS16F95W/883 | Texas Instruments | Check for Price | EIA-485/EIA-422A Differential Bus Transceivers 10-CFP -55 to 125 | DS16F95WFQMLV vs DS16F95W/883 |
5962-8961501HX | Texas Instruments | Check for Price | LINE TRANSCEIVER, CDFP10, CERAMIC, SOIC-10 | DS16F95WFQMLV vs 5962-8961501HX |
DS16F95W-SMD | Texas Instruments | Check for Price | LINE TRANSCEIVER, CDFP10, CEREMIC, DFP-10 | DS16F95WFQMLV vs DS16F95W-SMD |
DS16F95W-QMLV | Texas Instruments | Check for Price | LINE TRANSCEIVER, CDFP10, CEREMIC, DFP-10 | DS16F95WFQMLV vs DS16F95W-QMLV |
DS16F95WFQML | Texas Instruments | Check for Price | LINE TRANSCEIVER, CDFP10, CEREMIC, DFP-10 | DS16F95WFQMLV vs DS16F95WFQML |
5962F8961501VHX | National Semiconductor Corporation | Check for Price | IC LINE TRANSCEIVER, CDFP10, CERPACK-10, Line Driver or Receiver | DS16F95WFQMLV vs 5962F8961501VHX |
DS16F95WFQMLV Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, use a heat sink if necessary, and consider derating the device's operating frequency and voltage according to the datasheet's thermal specifications.
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Using a different clock source than the recommended crystal oscillator may affect the device's jitter performance, clock accuracy, and overall system reliability. It's essential to consult the datasheet and application notes for guidance on using alternative clock sources.
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To troubleshoot issues related to signal integrity and crosstalk, use simulation tools like IBIS or SPICE models to analyze the signal paths, and consider using signal integrity analysis software to identify potential issues. Additionally, follow best practices for PCB layout, such as separating analog and digital signals, using differential pairs, and adding shielding or guard traces.
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When using the DS16F95WFQMLV in a radiation-hardened or high-reliability application, consider the device's total ionizing dose (TID) and single-event effect (SEE) ratings, and follow guidelines for radiation-hardened design and testing. Additionally, consult with the manufacturer and relevant industry standards for specific requirements and recommendations.