Part Details for DLA20IM800PC by Littelfuse Inc
Results Overview of DLA20IM800PC by Littelfuse Inc
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Electronic Manufacturing
Telecommunications
Automotive
DLA20IM800PC Information
DLA20IM800PC by Littelfuse Inc is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for DLA20IM800PC
DLA20IM800PC CAD Models
DLA20IM800PC Part Data Attributes
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DLA20IM800PC
Littelfuse Inc
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Datasheet
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DLA20IM800PC
Littelfuse Inc
Rectifier Diode, 1 Phase, 1 Element, 20A, 800V V(RRM), Silicon, TO-263AB, ROHS COMPLIANT, PLASTIC, D2PAK-3
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | LITTELFUSE INC | |
| Package Description | R-PSSO-G2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Samacsys Manufacturer | LITTELFUSE | |
| Additional Feature | LOW LEAKAGE CURRENT | |
| Application | GENERAL PURPOSE | |
| Case Connection | CATHODE | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 1.24 V | |
| JEDEC-95 Code | TO-263AB | |
| JESD-30 Code | R-PSSO-G2 | |
| JESD-609 Code | e3 | |
| Non-rep Pk Forward Current-Max | 200 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 175 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Current-Max | 20 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Power Dissipation-Max | 83 W | |
| Qualification Status | Not Qualified | |
| Rep Pk Reverse Voltage-Max | 800 V | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | SINGLE |
DLA20IM800PC Frequently Asked Questions (FAQ)
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The recommended PCB layout involves placing the device on a multi-layer board with a solid ground plane, using thermal vias to dissipate heat, and keeping the component footprint as small as possible. Additionally, a heat sink or thermal interface material can be used to improve thermal management.
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To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the pads, and use a reflow oven or hot air soldering technique to avoid overheating the device.
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Exceeding the maximum junction temperature rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the specified temperature range to maintain reliability and performance.
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To prevent electrostatic discharge (ESD) damage, handle the device with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the device is stored in a protective package, and avoid touching the pins or leads during assembly.
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Use a curve tracer or a parameter analyzer to measure the device's electrical characteristics, such as voltage and current ratings. Perform tests under various operating conditions, including temperature and voltage sweeps, to ensure the device meets the specified performance criteria.