Part Details for DF36912GFHWV by Renesas Electronics Corporation
Results Overview of DF36912GFHWV by Renesas Electronics Corporation
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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DF36912GFHWV Information
DF36912GFHWV by Renesas Electronics Corporation is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for DF36912GFHWV
DF36912GFHWV CAD Models
DF36912GFHWV Part Data Attributes
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DF36912GFHWV
Renesas Electronics Corporation
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Datasheet
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DF36912GFHWV
Renesas Electronics Corporation
Microcontrollers with a 32-bit H8/300H CPU core (Non Promotion), , /
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | QFP | |
| Pin Count | 32 | |
| Manufacturer Package Code | PLQP0032GC | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | Renesas Electronics | |
| Bit Size | 16 | |
| CPU Family | H8/300H | |
| JESD-30 Code | S-PQFP-G32 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP32,.35SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 1536 | |
| ROM (words) | 8192 | |
| ROM Programmability | FLASH | |
| Speed | 12 MHz | |
| Supply Current-Max | 18 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
DF36912GFHWV Frequently Asked Questions (FAQ)
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Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, copper pours, and other layout considerations to ensure optimal thermal performance.
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Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The datasheet provides guidelines for selecting the current sense resistor value and the comparator threshold.
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Renesas recommends using a low-ESR ceramic capacitor with a value between 4.7uF to 10uF, depending on the input voltage and current requirements. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ripple.
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Renesas provides EMC guidelines in their application notes, which include recommendations for PCB layout, component selection, and shielding. Additionally, Renesas recommends following the IEC 61000-4-2 standard for electromagnetic immunity testing.
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The maximum operating temperature range for the DF36912GFHWV is -40°C to +125°C, as specified in the datasheet. However, Renesas recommends derating the device's performance at temperatures above 85°C to ensure reliable operation.