Part Details for DF3048BF25V by Renesas Electronics Corporation
Results Overview of DF3048BF25V by Renesas Electronics Corporation
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
DF3048BF25V Information
DF3048BF25V by Renesas Electronics Corporation is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for DF3048BF25V
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
84AC1314
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Newark | Mcu, 16Bit, 25Mhz, Qfp-100, Product Range:H8 Family, H8/300H Series, H8/3048B Group Microcontrollers, Device Core:-, Data Bus Width:16 Bit, Operating Frequency Max:25Mhz, Program Memory Size:128Kb, No. Of Pins:100Pins, Interfaces:Scirohs Compliant: Yes |Renesas DF3048BF25V RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 11 |
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$28.4800 / $38.2200 | Buy Now |
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DISTI #
DF3048BF25V-ND
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DigiKey | IC MCU 16BIT 128KB FLASH 100QFP Lead time: 12 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
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DISTI #
DF3048BF25V
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Avnet Asia | QFP100128K FLASH, 4K RAM, 25MHZ (Alt: DF3048BF25V) RoHS: Compliant Min Qty: 90 Package Multiple: 90 | 0 |
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RFQ | |
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DISTI #
DF3048BF25V
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Avnet Silica | QFP100128K FLASH 4K RAM 25MHZ (Alt: DF3048BF25V) RoHS: Compliant Min Qty: 90 Package Multiple: 90 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Vyrian | Peripheral ICs | 333 |
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RFQ |
Part Details for DF3048BF25V
DF3048BF25V CAD Models
DF3048BF25V Part Data Attributes
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DF3048BF25V
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
DF3048BF25V
Renesas Electronics Corporation
16-bit Microcontrollers with Embedded 512KB Flash Microcomputer (Non Promotion), FQFP, /
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | FQFP | |
| Package Description | 14 X 14 MM, 0.50 MM PITCH, PLASTIC, QFP-100 | |
| Pin Count | 100 | |
| Manufacturer Package Code | PRQP0100KA | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | Renesas Electronics | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 8 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G100 | |
| Length | 14 mm | |
| Number of I/O Lines | 78 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 3.05 mm | |
| Speed | 25 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
DF3048BF25V Frequently Asked Questions (FAQ)
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A 4-layer PCB with a dedicated ground plane and thermal vias is recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
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To ensure reliable operation, follow the recommended operating conditions, and consider the device's thermal characteristics. Implement thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
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To ensure EMI and EMC compliance, follow proper PCB layout practices, use shielding, and implement filtering and decoupling techniques. Ensure that the device is properly grounded, and use EMI-absorbing materials if necessary.
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Use a systematic approach to troubleshoot issues, starting with visual inspection, then moving to signal integrity analysis, and finally, using debugging tools like oscilloscopes and logic analyzers. Consult the datasheet and application notes for specific guidance.
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Operating the device at maximum ratings can reduce its lifespan and reliability. Ensure that the device operates within the recommended operating conditions to maintain optimal performance and reliability.