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Rectifier Diode, 1 Phase, 2 Element, 573A, 3400V V(RRM), Silicon, MODULE-3
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
DD435N34KHPSA1 by Infineon Technologies AG is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
49AC0181
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Newark | Diode Module, Dual, 3.4Kv, 435A, Repetitive Reverse Voltage Vrrm Max:3.4Kv, Forward Current If(Av):435A, Forward Voltage Vf Max:1.71V, Diode Module Configuration:Dual Series, Product Range:-, Svhc:No Svhc (27-Jun-2018) Rohs Compliant: Yes |Infineon DD435N34KHPSA1 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 2 |
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$589.0700 | Buy Now |
DISTI #
448-DD435N34KHPSA1-ND
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DigiKey | DIODE MOD GP 3400V 573A MOD Min Qty: 1 Lead time: 24 Weeks Container: Tray |
2 In Stock |
|
$420.7600 | Buy Now |
DISTI #
DD435N34KHPSA1
|
Avnet Americas | Rectifier Diode Module (non Schottky) 3400V 435A 3-Pin PB60-1 Tray - Trays (Alt: DD435N34KHPSA1) RoHS: Compliant Min Qty: 2 Package Multiple: 2 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$467.8879 | Buy Now |
DISTI #
66364435
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Verical | Rectifier Diode RoHS: Compliant Min Qty: 1 Package Multiple: 1 | Americas - 2 |
|
$387.0000 | Buy Now |
DISTI #
DD435N34KHPSA1
|
Chip One Stop | Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Tray | 2 |
|
$337.0000 / $387.0000 | Buy Now |
DISTI #
SP000083036
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EBV Elektronik | Rectifier Diode Module non Schottky 3400V 435A 3Pin PB601 Tray (Alt: SP000083036) RoHS: Compliant Min Qty: 2 Package Multiple: 2 Lead time: 25 Weeks, 0 Days | EBV - 0 |
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Buy Now |
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DD435N34KHPSA1
Infineon Technologies AG
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Datasheet
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Compare Parts:
DD435N34KHPSA1
Infineon Technologies AG
Rectifier Diode, 1 Phase, 2 Element, 573A, 3400V V(RRM), Silicon, MODULE-3
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | MODULE-3 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Factory Lead Time | 24 Weeks | |
Samacsys Manufacturer | Infineon | |
Additional Feature | HIGH RELIABILITY | |
Application | GENERAL PURPOSE | |
Case Connection | ISOLATED | |
Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS | |
Diode Element Material | SILICON | |
Diode Type | RECTIFIER DIODE | |
Forward Voltage-Max (VF) | 1.71 V | |
JESD-30 Code | R-PUFM-X3 | |
Non-rep Pk Forward Current-Max | 12000 A | |
Number of Elements | 2 | |
Number of Phases | 1 | |
Number of Terminals | 3 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -40 °C | |
Output Current-Max | 573 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | FLANGE MOUNT | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Reference Standard | UL RECOGNIZED | |
Rep Pk Reverse Voltage-Max | 3400 V | |
Reverse Current-Max | 50000 µA | |
Surface Mount | NO | |
Terminal Form | UNSPECIFIED | |
Terminal Position | UPPER | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the IGBT's gate-emitter voltage. The driver should also have a suitable propagation delay and rise/fall time to ensure proper switching.
The maximum allowed overcurrent is typically 2-3 times the rated current. To protect the module, use a fast-acting fuse or a current sensor with a shutdown circuit to detect overcurrent conditions and disconnect the power supply.
Use a heat sink with a thermal resistance of ≤ 0.5 K/W and ensure good thermal contact between the module and heat sink. Also, provide adequate airflow and consider using a fan or other cooling system for high-power applications.
Follow Infineon's recommended soldering and assembly guidelines, which include using a soldering iron with a temperature of 250°C, a soldering time of ≤ 3 seconds, and ensuring the module is properly cleaned and dried before assembly.